Advanced Package Development, Signal and Power Integrity Senior Staff Engineer

Marvell Technology • Santa Clara, CA

3d

About The Position

About Marvell Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities. At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead. Your Team, Your Impact Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, Marvell’s innovative technologies enable new possibilities and power the next generation of performance‑driven systems. Within this ecosystem, Marvell’s central advanced packaging organization plays a critical role in delivering next‑generation connectivity and compute products. The organization brings deep expertise in architecture, package design, and electrical performance, including SI/PI to develop advanced IC packages that support high‑speed interfaces. This work directly shapes product performance, reliability, and time‑to‑market, making it a key contributor to Marvell’s overall technology leadership. What You Can Expect Marvell’s Central Engineering team is seeking a talented High-speed IC package development engineer to contribute to the development of advanced microelectronic packages for semiconductors supporting 448 Gb/s data rates and beyond. The engineer will be responsible for package development, electrical design, modeling, and characterization, including all signal and power integrity aspects. The engineer will also interface with package suppliers to select package technology, drive layout, ensure manufacturability, and compliance with performance, reliability, and cost requirements. The engineer will interface with marketing and IC designers to develop achievable package specs and contribute to new package technology development.

Requirements

• At least a Bachelor’s degree in Computer Science, Electrical Engineering or related fields and 5-10 years of related professional experience OR a Master’s degree and/or PhD in Computer Science, Electrical Engineering or related fields with 3-5 years of experience.
• Strong fundamentals in EM, transmission lines and microwave theory
• Experience in using 2-D and 3-D EM simulation tools such as Ansys HFSS, SI-Wave, Cadence Clarity
• Frequency domain and time domain knowledge of high speed signaling
• Ability to automate the SI, PI and Packaging activities using scripting tools like Python.
• Experience with high-speed electronic packaging for digital and analog ICs
• Power plane design, modeling and analysis using tools like PowerSI, SIwave
• Working knowledge of circuit design tools: Spectre, ADS, HSpice
• Understanding, debugging and simulations of EMI/EMC problems
• Familiarity with packaging technologies, materials, package substrate design rules and assembly rules
• Ability to manage package development involving various cross functional teams like assembly development, IC physical layout teams, Analog and Digital designers, marketing.
• Familiarity with IC package layout tools like APD or PADS
• A team player
• Strong communication, presentation, and documentation skills

Nice To Haves

• Experience with 2.5D/3D package development is highly desired.
• Experience with CPC/CPO connectors is highly desired.
• Experience with channel simulations using MATLAB or ADS or other tools is a plus.
• Track record of new product introduction from concept, through development and production is a plus.
• Knowledge of the thermal and mechanical analysis of the IC package development is a plus.

Responsibilities

• package development
• electrical design
• modeling
• characterization, including all signal and power integrity aspects
• interface with package suppliers to select package technology, drive layout, ensure manufacturability, and compliance with performance, reliability, and cost requirements
• interface with marketing and IC designers to develop achievable package specs and contribute to new package technology development

Benefits

• employee stock purchase plan with a 2-year look back
• family support programs to help balance work and home life
• robust mental health resources to prioritize emotional well-being
• recognition and service awards to celebrate contributions and milestones

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level