We develop some of the world’s most advanced semiconductor packaging technologies as part of Intel’s Foundry Technology Manufacturing (FTM) organization. Within the Advanced Packaging and Technology Manufacturing (APTM) group, you will join a team focused on developing AI‑driven solutions that transform every stage of advanced packaging development—from early design concepts to high‑volume manufacturing. In this role, you will build Agentic components that integrate complex, multi-disciplinary capabilities into a state‑of‑the-art Agentic framework.
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Job Type
Full-time
Career Level
Mid Level
Number of Employees
5,001-10,000 employees