AI-optimized Physical/Platform Architect
About The Position
Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Interested in changing the landscape of artificial intelligence workloads? Join our team where we are building next-generation, high-performance memory solutions for AI. In Micron's AI-optimized Memory Architecture organization, we partner closely with customers to design and deliver memory solutions purpose-built for emerging AI systems and applications. As a Member of Technical Staff in the AI-optimized Architecture team, you will contribute to the definition of physical/platform architecture of tightly coupled, high‑performance memory for AI workloads. Apply expert knowledge to analyze electrical and physical architecture trade-offs in close collaboration with peer architecture, design, and packaging teams. Your responsibilities will encompass definition, evaluation, and specification of technology requirements, thermal management architectures, power delivery architectures, and definition of on- and off-chip interfaces.
Requirements
- Contributions to physical, thermal and power delivery solutions for stacked architectures.
- Experience with advanced packaging building blocks and techniques.
- Experience with high efficiency, stacked SoC and/or DRAM architectures and designs.
- Ability to influence decisions through data-driven systems analysis and clear communication.
- Ability to analyze and reason across several different domains to find optimal cross-domain solutions.
- A Masters or PhD in Computer Science, Computer Engineering, Electrical Engineering, or equivalent experience.
- 5+ years of proven industry experience delivering silicon‑demonstrated SoC hardware designs, stacked memory or logic designs, or complex packaging architectures.
Nice To Haves
- Experience with analog and digital design, including architecture tradeoff analysis, specification development and definition, and prototype design.
- Experience with high-performance memory devices and memory systems, like HBM.
- Experience analyzing thermal performance with thermal modeling tools (e.g., FloTherm).
- Experience with architecture, simulation and design of 2.5D and 3D IO interfaces on modern foundry nodes.
- Experience with power delivery and thermal architectures, tradeoffs, constraints, and challenges.
Responsibilities
- Architect and specify thermal management, power delivery, and on-/off-chip interfaces for high-performance stacked memories.
- Collaborate with experts across SoC/memory design, memory systems architecture, and advanced packaging to explore tradeoffs and define architectures and requirements.
- Compose and maintain clear architecture documentation that aligns design intent across teams.
Benefits
- Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future.
- We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget.
- Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave.
- Additionally, Micron benefits include a robust paid time-off program and paid holidays.
- For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.
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What This Job Offers
Job Type
Full-time
Career Level
Mid Level
