ASIC Engineer Principal

Hewlett Packard Enterprise • Sunnyvale, CA

1d • Hybrid

About The Position

ASIC Engineer Principal This role has been designed as ‘Hybrid’ with an expectation that you will work on average 2 days per week from an HPE office. Who We Are: Hewlett Packard Enterprise is the global edge-to-cloud company advancing the way people live and work. We help companies connect, protect, analyze, and act on their data and applications wherever they live, from edge to cloud, so they can turn insights into outcomes at the speed required to thrive in today’s complex world. Our culture thrives on finding new and better ways to accelerate what’s next. We know varied backgrounds are valued and succeed here. We have the flexibility to manage our work and personal needs. We make bold moves, together, and are a force for good. If you are looking to stretch and grow your career our culture will embrace you. Open up opportunities with HPE. Job Description: SoC Top-Level & block-level Physical Design Engineer As a block-level and top-level SOC Physical Design Engineer, you will contribute to all phases of physical design from RTL to the delivery of our final GDSII. Your responsibilities include:

Requirements

• Education: BS degree in electrical engineering, computer engineering, or a related field with 7+ years of experience in block or full-chip physical design, or MS degree in the above fields with 5+ years of related experience.
• Technical Expertise: Deep design experience in large SoC designs, including IP integration, padring design, bump planning, and RDL routing strategy.
• Extensive knowledge and practices in Physical Design, including physically aware synthesis, floor-planning, place & route, CTS, and repeater/feedthrough.
• Experience in developing and implementing power-grid and clock network at chip level.
• Knowledge of basic SoC architecture and HDL languages like Verilog to work with the logic design team for timing fixes.
• Experience in physical design verification to debug LVS/DRC/ERC/ANT issues at chip/block level.
• Experience in custom place and route.
• Proficiency in writing Linux shell scripts in Perl, TCL, and Python.
• Real chip tapeout experience in 7nm and/or below with a successful signoff track record .
• Self-motivated with strong problem-solving and debugging skills.
• Ability to work effectively in a dynamic group environment.

Nice To Haves

• Exposure to 2.5D/3D packaging is preferred.
• High performance and large chip design experience is preferred.
• Exposure to DFT is preferred.

Responsibilities

• Implement physical design at the large SoC chip level from RTL to GDSII, creating a design database ready for manufacturing.
• Interact with IP vendors to understand IP integration requirements and integrate all blocks, IPs, and sub - chips at a large SoC level.
• Collaborate with the packaging team on Microbump / Probe Bump/ Bump/Pad placement.
• Build full chip floorplan, including pads/ports/ b ump placement, block placement and optimization, block pins placement and alignment, power grid, and RDL design , etc.
• Develop the chip-level clock network and clock stations in collaboration with clock experts.
• Budget timing among blocks and sub - chips at the chip level, generating block/chip-level static timing constraints.
• Arrange, analyze, and optimize feedthrough and repeaters among all blocks/ sub - chips at the chip level.
• Perform block-level place and route, including custom place & route, ensuring the design meets timing, area, power constraints, and all sign-off criteria.
• Generate and implement ECOs to fix timing, signal integrity, EM/IR violations, PV, and complete formal verification.
• Integrate DFT into physical design, ensuring alignment with overall test strategies and manufacturing requirements.
• Run Physical Design verification flow at chip/block level, fixing LVS/DRC/ERC/ANT violations.
• Collaborate closely with architecture, frontend design, DV, and package teams to ensure cohesive design implementation and successful project tapeouts

Benefits

• Health & Wellbeing We strive to provide our team members and their loved ones with a comprehensive suite of benefits that supports their physical, financial and emotional wellbeing.
• Personal & Professional Development We also invest in your career because the better you are, the better we all are. We have specific programs catered to helping you reach any career goals you have — whether you want to become a knowledge expert in your field or apply your skills to another division.
• Unconditional Inclusion We are unconditionally inclusive in the way we work and celebrate individual uniqueness. We know varied backgrounds are valued and succeed here. We have the flexibility to manage our work and personal needs. We make bold moves, together, and are a force for good.

What This Job Offers

• Job Type: Full-time
• Career Level: Principal