Die Fab Process Engineering Technician

Keysight Technologies, Inc.•Santa Rosa, CA

2d•$84,370 - $140,620

About The Position

Keysight is at the forefront of technology innovation, delivering breakthroughs and trusted insights in electronic design, simulation, prototyping, test, manufacturing, and optimization. Our ~15,000 employees create world-class solutions in communications, 5G, automotive, energy, quantum, aerospace, defense, and semiconductor markets for customers in over 100 countries. Learn more about what we do. Our award-winning culture embraces a bold vision of where technology can take us and a passion for tackling challenging problems with industry-first solutions. We believe that when people feel a sense of belonging, they can be more creative, innovative, and thrive at all points in their careers. Keysight Technologies, the world's premier measurement company, has an opening for R&D Process Technician position at the High Frequency Technology Center in Santa Rosa, California. Live in beautiful Sonoma County amongst vineyards, redwood forests, rivers, lakes, and coastline while working on state-of-the-art ICs and devices. R&D Wafer Fab Process Technician at HFTC is responsible for assisting engineers in process development and sustaining of custom, cutting edge, micro and nano-fabrication technologies for high performance microwave and millimeter-wave applications. The technologies include InP and GaAs-based HBTs, HEMTs, BOLT, and other advanced electronic components that enable key competitive differentiation of Keysight’s industry-leading RF, microwave, and high bit rate instruments. The focus of this position is on Die Fab & Backside processes for current and future MMIC products, as well as advanced high frequency packaging development. These processes include MMIC wafer thinning, wafer separation (laser & saw), chip sort, visual inspection, outgoing quality, and heterogeneous integration of high frequency components. Responsibilities include but are not limited to the following: Ownership of Die Fab processes and equipment to drive production sustaining and R&D activities. Collaborate with Operations Group to implement robust process control; diagnose and resolve process problems. Prepare and maintain equipment and process documentation. Work closely with Process, Integration, Product, and Circuit Design Engineers to define process and device performance targets Assist engineers to define process flows, develop new fabrication processes, and drive continuous process improvement (CPI) efforts to maximize product yield Ensure successful transfer and maintenance of new technologies in manufacturing. Project objectives will encompass performance, reliability, and manufacturing goals. Assist with heterogeneous integration development projects that are critical to Keysight’s high frequency packaging roadmap Participate & assist in capital equipment acquisition projects that include tool evaluation, characterization, process development, and qualification.

Requirements

Minimum high school graduates with strong aptitude in science and math. Junior college or B.S. degree in STEM field is highly preferred.
Minimum 3 years of relevant experience in Wafer Fab and/or Die Fab.
Hands-on experience with advanced semiconductor device fabrication is required and specific skills in wafer separation, chip sort, automatic visual inspection, plasma etch, wet etch, and wafer thinning are highly preferred.
Knowledge and experience with statistical process control (SPC) and design of experiments (DOE) is a valued qualification.
Candidates must have excellent interpersonal, problem solving, and communication (oral & written) skills for successful inter and intra-group interactions.
Self-motivated to learn new skills on their own or through training, and a willingness to teach that knowledge to the rest of the team

Nice To Haves

Junior college or B.S. degree in STEM field is highly preferred.
Hands-on experience with advanced semiconductor device fabrication is required and specific skills in wafer separation, chip sort, automatic visual inspection, plasma etch, wet etch, and wafer thinning are highly preferred.
Knowledge and experience with statistical process control (SPC) and design of experiments (DOE) is a valued qualification.

Responsibilities

Ownership of Die Fab processes and equipment to drive production sustaining and R&D activities.
Collaborate with Operations Group to implement robust process control; diagnose and resolve process problems. Prepare and maintain equipment and process documentation.
Work closely with Process, Integration, Product, and Circuit Design Engineers to define process and device performance targets
Assist engineers to define process flows, develop new fabrication processes, and drive continuous process improvement (CPI) efforts to maximize product yield
Ensure successful transfer and maintenance of new technologies in manufacturing. Project objectives will encompass performance, reliability, and manufacturing goals.
Assist with heterogeneous integration development projects that are critical to Keysight’s high frequency packaging roadmap
Participate & assist in capital equipment acquisition projects that include tool evaluation, characterization, process development, and qualification.