DRY ETCH PROCESS DEVELOPMENT ENGINEER (WRITER) (49917)

HEADWAY TECHNOLOGIES INC•Milpitas, CA

1d•Onsite

About The Position

Under the direction of the Director of Dry Etch Process Development, the Dry Etch Process Development Engineer (Writer) is responsible for the developing and implementing new RIE, IBD, and Ashing processes for next generation magnetic recording heads, including implementing new process control schemes which ensure product manufacturability; designs and conducts experiments, analyzes data, and presents findings; researches, selects, and qualifies new tools which improve efficiency and yield. This position is located in Milpitas, California.

Requirements

Bachelor’s degree in Materials Science, Physics, or Electrical Engineering and/or equivalent relevant experience; Master’s degree preferred
Three years of experience working in the magnetic recording head, hard disk drive, or semiconductor industry as a Process Engineer
Experience in plasma etch process development (RIE, IBE, Ashing, etc.) is preferred
Experience working in a wafer fab manufacturing environment
Experience with Statistical Process Control (SPC)
Proficient in the use of Microsoft Office Applications
Knowledge of semiconductor or HDD industry principles, practices, and techniques
Knowledge of wafer fabrication processing techniques, including process development and integration practices
Knowledge of plasma etch (RIE, IBE, ashing, etc.) principles, practices, and techniques
Knowledge of TEM, SEM, and FIB and ability to analyze data from these sources to determine root cause of failure
Knowledge and ability to use Excel, JMP, or other software applications such as VBA to analyze data, create reports, present findings, and recommend appropriate action
Knowledge and ability to use Microsoft Office applications to create reports and presentations
Able to communicate effectively, both verbally and in writing, with all levels of contractors, consultants, employees, and management
Able to work productively and collaboratively with all levels of employees and management
Able to comply with all safety policies and procedures
Demonstrated organizational and time management skills
Demonstrated problem-solving and trouble shooting skills
Flexible and able to prioritize

Responsibilities

Develops and implements new dry etch processes (RIE, IBE, and Ashing) for next generation magnetic recording heads
Implements new process control schemes or methodologies which ensure product manufacturability
Designs and conducts experiments, analyzes data, and develops recommendations for improving performance and yield while reducing scrap
Adheres to appropriate timeline for introducing new processes into the manufacturing line
Reviews characterization data from FIB, SEM, and TEM tools to conduct root cause analysis and recommend corrective action
Partners with other groups and departments, including process and product engineering to develop and deliver products and programs
Oversees the work of the Process Technicians to ensure accurate process execution and efficient wafer disposition
Partners with Equipment Engineering to research, select, and qualify new RIE tools
Adheres to all safety policies and procedures as required
Performs other duties of a similar nature or level