About the position
Thermo Fisher Scientific Inc. is the world leader in serving science, with annual revenue exceeding $25 billion. Our Mission is to enable our customers to make the world healthier, cleaner and safer. Whether our customers are accelerating life sciences research, solving sophisticated analytical challenges, improving patient diagnostics and therapies or efficiency in their laboratories, we are here to support them. The R&D group at the Tewksbury site is responsible for the design and maintenance of Thermo Fisher's lineup of hand-held, chemical identification analyzers (Raman and IR spectrometers) and elemental analyzers (XRF spectrometers). This position is a critical resource in new product development and sustaining activities requiring extensive experience in circuit and PCB design, both digital and analog.
Responsibilities
- Work within a multi-functional engineering team to bring new products to market
- Focus on design efficiencies, risk mitigation, cost reduction and overall product quality
- High speed digital design (microcontroller and FPGA) and ability to assess PCB layout fidelity
- Analog circuit design (power conversion, low noise signal amplification and conversion, circuit impedance control, motor control)
- Design for EMC and ESD compliance (IEC61010)
- Employ electrical test instruments to perform validation testing and root cause analysis of issues on small form factor PCB designs
- Provide ownership of projects and tasks and take initiative in addressing technical challenges
- Assist in the improvement and implementation of product design processes
Requirements
- Bachelor's or Master's in Electrical Engineering and 4+ years of relative experience
- Deep understanding of microcontroller/FPGA based circuit designs and comm bus architectures
- Proven background in analog design in one or more areas (precision signal measurement, power conversion, motor control, antenna design, other)
- Proficiency with schematic design and PCB layout tools (Cadence and/or Altium preferred)
- Strong background in high speed PCB design requirements (stack-up definition, impedance control, grounding, materials)
- Detailed understanding of DFM/DFA constraints and component layout (IPC standards)
- Understanding of the physics behind the successful mitigation of ESD and EMI
- Strong organization, communication and project management skills
