Engineer, Principal - Mobile Chipset

Qualcomm • San Diego, CA

1d

About The Position

We are looking for engineering lead for a mobile chipset. A mobile chipset comprises multiple chips that together perform the functions of a mobile device (such as Application Processor, Modem, PMICs, Connectivity chips, Transceivers, and RF front end components), and associated Software/Firmware.

Responsible for planning and execution of the chipset through all phases from concept to commercialization across all engineering teams, including meeting all engineering KPIs such as timeliness, stability, reliability, performance, power, etc.
Works closely with chipset Program Manager, chipset Product Manager, and leads from various engineering teams to ensure delivery of hardware, software, test, documentation, and tools to enable on-time launch of customer devices in the market. Ultimately responsible for driving resolution of all engineering issues on the chipset whether within a specific subsystem, or across subsystems, functions, and chipset components. Final point of escalation for customer engineering issues. Responsible for clearly communicating engineering status of the project to executives. Works in a highly matrixed environment. This role frequently requires working with others to fulfill job responsibilities without direct authority

Requirements

• Bachelor's degree in Electrical Engineering, Computer Science, Computer Engineering, or related field and 8+ years of Electrical, Computer, or Software Engineering or related work experience.
• OR Master's degree in Electrical Engineering, Computer Science, Computer Engineering, or related field and 7+ years of Electrical, Computer, or Software Engineering or related work experience.
• OR PhD in Electrical Engineering, Computer Science, Computer Engineering, or related field and 6+ years of Electrical, Computer, or Software Engineering or related work experience.
• 8+ years of experience in one or more areas of semiconductor product development.
• 5+ years in a technical leadership role.

Nice To Haves

• Master's Degree or Ph.D. in Electrical Engineering, Computer Engineering, Computer Science, or related field.
• 15+ years of experience in one or more areas of semiconductor product development (e.g., system design, architecture, HW design and validation, SW development).
• 5+ years of experience balancing tradeoffs between product KPIs and costs.
• 5+ years of experience managing project costs.
• 4+ years of experience working in a large matrixed organization.
• 3+ years of work experience in a role requiring interaction with executive leadership.

Responsibilities

• Leverages expert knowledge of Application Processor/Modem chipsets to influence and oversee chipset development and ensures chips are performing the functions of a device (e.g., Application Processor, Modem, PMICs, Connectivity chips, Transceivers, and RF front end components) and associated Software/Firmware.
• Oversees the resolution of all engineering issues on the chipset whether within a specific subsystem, or across subsystems, functions, and chipset components.
• Outlines schedules, costs, requirements, and KPIs (e.g., power, performance, reliability) from concept to commercialization.
• Influences development of new methodology for verification of KPIs (performance, power, and quality) of all components across the chipset; provides technical oversight to teams conducting hardware, software, or systems-level testing, verification, and validation to ensure project plans and specifications are met.
• Sets guidelines for writing detailed technical documentation and feature descriptions; writes and reviews documentation.

What This Job Offers

• Job Type: Full-time
• Career Level: Principal