Fab Module Engineer

Intel Corporation • Aloha, OR

1d • Hybrid

About The Position

Join Intel and build a better tomorrow. Our exciting vision: Extend computing technology to connect and enrich the lives of every person on earth. Join us as we create the next generation of technologies that will shape the future for decades to come. The Wafer Packaging Manufacturing (WPM) organization owns a crucial part of semiconductor wafer processing, testing, and die-to-wafer assembly. In addition to traditional product types, we drive Intel's advanced packaging strategy - bringing compelling capabilities to market and enabling large-scale AI computing. Within WPM, the fab module engineer role is multifaceted. The ideal candidate will have a passion for equipment and process optimization with the goal of developing a robust manufacturing process module. You will be responsible for owning all aspects of one or more of our factory's 300mm toolsets in the segment responsible for thick metal/via layers, bumping, reflow, thinning, and backside metallization. Sustaining responsibilities will include safety, tool health and matching, process health and matching (process control systems), excursion prevention and response, and enabling a diverse range of product types to run efficiently through the line. You will work with partners in other geographies to ensure the factory network consistently and cohesively delivers high-quality, high-confidence products for our customers. You will be responsible for delivering Model of Record tool performance and drive continuous improvement toward tool availability, cycle time, defect density, and cost. Our organization supports the full process/product lifecycle for this segment, inclusive of early development, ramp readiness, ramp, and long-term high-volume manufacturing. Thus, your responsibilities may include elements of module-level development. Examples include defining roadmaps to meet process/product requirements, driving equipment configuration changes, designing and conducting experiments, materials development and selection, and characterization of defect modes and integrated issues/marginality with proposals to resolve them. Module engineers must solve problems utilizing formal education, self-driven knowledge and upskilling, statistical knowledge, and effective problem-solving tools/methods. Additionally, engineers must build lasting capability for the module through training others; robust documentation; cogent analysis and presentation of data; thorough transfer to other sites; and hardening systems for safety, quality, output, and cost. The ideal candidate will demonstrate the following traits: They are capable of working in a high-performing culture with high expectations, execution with urgency, and personal ownership They are data-driven and are motivated to solve problems, independently and in a group setting, with high commitment to task They thrive in a dynamic and ambiguous environment They possess excellent teamwork and leadership skills with outstanding communication, interpersonal, and influencing skills Working with us is an opportunity to transform technology and create a better future. We foster a collaborative, supportive, and exciting work environment, where the brightest minds come together to achieve exceptional results. We offer competitive salary and financial benefits as well as programs that promote health and well-being. We strive for a more connected and intelligent future, and we are excited for you to join us in that mission.

Requirements

• Must have a Bachelor's Degree in an Engineering STEM related field (e.g., Electrical Engineering, Chemistry, Chemical Engineering, Mechanical Engineering, Material Science, Physics, Robotics, Molecular and Nanomaterials, Nanoengineering)

Nice To Haves

• Knowledge of statistics and experimental design and the skills to apply that knowledge to tool matching, tool qualification, and process development
• Strong data analysis and presentation acumen
• Strong technical and troubleshooting skills
• Ability to work across organizational boundaries including module process engineering, manufacturing, integration and yield
• Excellent teamwork and leadership skills with outstanding communication, interpersonal, and influencing skills

Responsibilities

• Owning all aspects of one or more of our factory's 300mm toolsets in the segment responsible for thick metal/via layers, bumping, reflow, thinning, and backside metallization.
• Sustaining responsibilities will include safety, tool health and matching, process health and matching (process control systems), excursion prevention and response, and enabling a diverse range of product types to run efficiently through the line.
• Work with partners in other geographies to ensure the factory network consistently and cohesively delivers high-quality, high-confidence products for our customers.
• Delivering Model of Record tool performance and drive continuous improvement toward tool availability, cycle time, defect density, and cost.
• Defining roadmaps to meet process/product requirements, driving equipment configuration changes, designing and conducting experiments, materials development and selection, and characterization of defect modes and integrated issues/marginality with proposals to resolve them.
• Building lasting capability for the module through training others; robust documentation; cogent analysis and presentation of data; thorough transfer to other sites; and hardening systems for safety, quality, output, and cost.

Benefits

• We offer competitive salary and financial benefits as well as programs that promote health and well-being.
• We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.

What This Job Offers

• Job Type: Full-time
• Career Level: Entry Level