Failure Analysis Engineer

Broadcom • Fort Collins, CO

2d • $91,000 - $146,000

About The Position

Broadcom is a world leader in custom ASIC design including but not limited to cutting edge AI solutions. Broadcom is in search of a Failure Analysis Engineer to join Broadcom's Global Operations Quality Assurance Team in Fort Collins, CO. The Failure Analysis team enables Broadcom to bring leading edge Silicon and Packaging solutions to market by providing root cause physical and electrical analysis support. Broadcom is seeking a highly skilled, results-oriented Failure Analysis Engineer. In this role, you will take ownership of the diagnosis and characterization of complex failures in advanced silicon (e.g., FinFET, GAA) and advanced packaging technologies (e.g. 2.5D, 3DIC, CPO) critical to Broadcom’s most sophisticated products, including our industry-leading AI accelerators and high-speed networking solutions. You will leverage your expertise across all facets of FA (i.e., fault isolation, EFA, PFA) to execute and refine FA workflows tailored for the rapidly evolving landscape of next-generation silicon and packaging technologies. This role is built for a hands-on, strategic problem-solver who can work independently to drive root-cause analysis, collaborate with global cross-functional teams, and maintain the high-quality standards required for bleeding-edge technologies.

Requirements

• Bachelor's or Master's degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, or a related field and 5+ years of relevant experience.
• Proficient in semiconductor device physics, fabrication processes, and packaging technologies.
• Proficiency in various failure analysis techniques and equipment (e.g., scan diagnostics, PEM, DLS, nanoprobing, SEM, EDS, FIB).
• Problem-solving skills and a methodical approach to root cause analysis.
• Ability to work independently and as part of a team in a fast-paced environment.
• Broad interests, self-driven, lifelong learner, and a good team member.
• Project management skills, capable of managing multiple root cause projects.

Nice To Haves

• Experience with <5nm FinFET or GAAFET technologies
• Experience with 2.5D, 3DICs, co-packaged optics (CPO), or co-packaged copper (CPC)
• Expertise in design-based FA (scan and memory diagnostics)
• Expertise in beam-based FA techniques (e.g., nanoprobing, PFIB delayering / cross-section)
• ATE test flow generation, pattern modification, and hardware
• In-depth knowledge of advanced package construction and failure analysis

Responsibilities

• Hands-on and technically proficient, capable of fault analysis across a wide range of silicon and package technology.
• Plan and execute individual FA plans through background data collection, ATE data log interpretation, non-destructive analysis (optical, CSAM, X-Ray, TDR, IV curve trace)
• Fault localization (ATE, application board, PEM, DLS, OBIRCh, thermal, scan, memory)
• Physical Analysis (mechanical, chemical, PFIB), nanoprobing, and analytical techniques (FIB, SEM, EDX) to isolate and characterize defects.
• Collaborate with global cross-functional teams (design, process, test, reliability) to identify root causes of failures from various stages of the product lifecycle (e.g., design, reliability, RMA).
• Clear communication of complex FA findings, both written and verbal, to enable data-driven corrective action of critical quality issues.
• Team-based culture through open communication, continuous improvement, and willingness to assist others.
• Team based project: Develop AI based IFA support for efficiency improvement.

Benefits

• Medical, dental and vision plans
• 401(K) participation including company matching
• Employee Stock Purchase Program (ESPP)
• Employee Assistance Program (EAP)
• company paid holidays
• paid sick leave and vacation time
• The company follows all applicable laws for Paid Family Leave and other leaves of absence.

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level