Filter Technician, Quantum AI

Google•Goleta, CA

4d•$99,000 - $140,000

About The Position

As a Filter Technician, you will be a key member of a team that rapidly iterates and prototypes custom hardware for quantum computing systems. These systems operate across a wide frequency range, from direct current (DC) to extremely high frequency (EHF), within specialized cryogenic environments. You will focus on addressing issues in the cryogenic hardware stack, specifically focusing on high-quality interconnects, wiring, filtering, isolation, and shielding. In this role, you will collaborate closely with hardware engineers to design, build, and test custom wiring, filtering, and shielding solutions. You will play a critical role in ensuring the smooth development and deployment of cryogenic hardware by keeping device records and manufacturing data current, while also monitoring inventory levels. Additionally, you will be responsible for producing prototype articles and conducting quality testing for production volumes of custom hardware. Your contributions will be essential for Google Quantum AI to build the scalable and reliable signal control and isolation schemes required for the next level of computation.The full potential of quantum computing will be unlocked with a large-scale computer capable of complex, error-corrected computations. Google Quantum AI's mission is to build this computer and unlock solutions to classically intractable problems. Our roadmap is focused on advancing the capabilities of quantum computing and enabling meaningful applications. The US base salary range for this full-time position is $99,000-$140,000 + bonus + equity + benefits. Our salary ranges are determined by role, level, and location. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific salary range for your preferred location during the hiring process. Please note that the compensation details listed in US role postings reflect the base salary only, and do not include bonus, equity, or benefits. Learn more about benefits at Google .

Requirements

Associate's degree, trade school certification, other verifiable training in a relevant technical field, or equivalent practical experience.
3 years of experience with electronics packaging, including printed circuit boards (PCBs), wire bonding, or die preparation.
Experience with hardware solder assembly processes (e.g., IPC J-STD-001).
Experience using optical and electrical inspection equipment (e.g., voltmeters, microscopes, or oscilloscopes).
Experience with metal cutting techniques.
Experience working with electrostatic discharge (ESD) sensitive devices.

Nice To Haves

Experience in a production hardware assembly and test environment.
Experience with microfabrication equipment and processes.
Experience using 3D Computer-Aided Design (CAD) software.
Experience operating manual or computer numerical control (CNC) milling machines and lathes.
Experience with test and measurement of radio frequency (RF) or cryogenic devices.
Experience managing printed circuit boards (PCBs) or silicon wafers and printed circuit board assembly (PCBA) processes.

Responsibilities

Build, maintain, and operate cryogenic test apparatuses, fixtures, and mounts for production screening and experimental prototyping.
Collect and analyze Vector Network Analyzer (VNA) data to characterize device performance.
Prepare and assemble Printed Circuit Boards (PCBs) and die using specialized fixturing.
Test electrical performance of components and support failure analysis by determining root causes and corrective actions.
Operate tools for metal deposition, lithography, etching, and device characterization.