HBM SoC Physical Design Engineer

Micron Technology•Folsom, CA

2d•$162,000 - $344,000

About The Position

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a SoC Physical Design Engineer in the Heterogeneous Integration Group (HIG), you will drive the implementation of advanced HBM SoC logic/base die designs from netlist to GDSII. You will work closely with RTL design, verification, DFT, IP providers, packaging/assembly, and manufacturing teams to deliver best‑in‑class PPA (performance, power, area) and robust signoff collateral for tape-out. This is a hands‑on role with opportunities to own blocks or top‑level integration across multiple product generations.

Requirements

Strong experience in SoC physical design implementation from netlist to GDSII on advanced nodes and complex designs.
Proficiency with industry EDA tools (e.g., Cadence Innovus/Tempus, Synopsys ICC2/PrimeTime, Siemens Calibre or equivalent).
Solid understanding of STA fundamentals, clocking, constraints (SDC), and common closure techniques (buffering, path shaping, useful skew, etc.).
Experience with power intent and power delivery considerations (e.g., UPF/CPF concepts, power grid planning, power gating implications).
Familiarity with physical verification/signoff concepts: DRC, LVS, ERC, parasitic extraction awareness, and signoff handoff quality.
Knowledge of IR/EM analysis, noise, coupling/crosstalk considerations, and mitigation strategies.
Strong scripting/automation skills using Python, TCL, Perl, and/or shell.

Nice To Haves

Experience with HBM / DRAM adjacent SoC designs, or memory-subsystem-heavy SoCs.
Bachelor’s or master’s degree in electrical engineering, Computer Engineering, or a related field.
Minimum 10 years of experience in a related field.
Proven ability to mentor and develop engineers early in their careers.

Responsibilities

Own physical implementation for SoC blocks and/or top-level, including floor-planning, placement, CTS, routing, and physical optimization to meet PPA targets.
Drive timing closure (setup/hold) across multi-mode/multi-corner (MMMC) scenarios; partner with RTL, architecture, and STA/signoff to converge designs.
Collaborate with design and integration teams to ensure clean implementation of clocking/reset strategy, power architecture, and SoC integration requirements.
Integrate and implement complex IP (e.g., controllers, microcontrollers, NOC, interfaces, MBIST/DFT logic, buffers, PHY‑adjacent logic) with focus on robust physical integration and timing/power integrity.
Perform and/or coordinate physical signoff, including DRC/LVS, IR drop/EM, and timing signoff, addressing violations efficiently.
Partner with DFT teams to ensure scan/MBIST requirements are physically realizable and do not compromise PPA or schedule.
Work with packaging, assembly, test, probe, and manufacturing collaborators to ensure builds meet manufacturability and quality requirements.
Support tape-out execution (checklists, ECO flows, signoff reviews) and contribute to post-silicon debug by correlating silicon behavior with PD/STA/power analysis.
Identify flow gaps and improve productivity through scripting/automation and best-practice methodology development.

Benefits

Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future.
We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget.
Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave.
Additionally, Micron benefits include a robust paid time-off program and paid holidays.
For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.

Stand Out From the Crowd

Upload your resume and get instant feedback on how well it matches this job.

Upload and Match Resume