IC Package Design Engineer, Staff

Qualcomm • San Diego, CA

2d

About The Position

The IC Package Architecture and Design Team at Qualcomm has an opening for Package/System Design Engineer. This team is responsible for road mapping, architecting, design methodology, design implementation and verification for all Qualcomm package products.

Requirements

• Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 4+ years of System/Package Design/Technology Engineering or related work experience.
• OR Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 3+ years of System/Package Design/Technology Engineering or related work experience.
• OR PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 2+ year of System/Package Design/Technology Engineering or related work experience.
• Basic knowledge in high-speed IO interfaces and electromagnetic field.
• Knowledge of IC packaging structures and package-board interaction.
• Basic knowledge of electronic packaging process and typical failure modes preferred.

Nice To Haves

• Proven fundamentals in electrical, material, thermal, or mechanical engineering fields.
• Familiarity with various sophisticated package configurations and assembly/substrate technology (Flip chip BGA, 2.5D/3D Interposer, etc.).
• Experience in package design and proficiency in Cadence Allegro platform tools (PCB Editor, Advanced Package Designer, APD/SiP).
• Basic understanding of some SI/PI tools (XtractIM, PowerSI, HFSS, Q3D, etc.), package model extraction, S-parameters, and RLGC model.
• Basic knowledge of substrate manufacturing process, structure, design rules, and material properties.
• Proven understanding of high-speed interfaces, including DDR, PCIe, UCIE, etc.
• Experience with Calibre tool and package design reviews.
• Knowledge of high-speed layout constraints (crosstalk mitigation, differential pairs).
• Solid understanding of Design Rules Check and Design for Manufacturing.
• Experience with 2.5D Si-Bridge design in Virtuoso or similar CAD tools is a plus.

Responsibilities

• Interface and coordinate with multi-functional groups throughout Qualcomm on new product package/SiP feasibility analysis, and selection.
• Own and drive advanced package selection, new generation product package structure, and configuration optimization.
• Responsible for Package/SIP physical design and layout, optimization, DV, and tape out.
• Work with multi-functional teams to achieve optimized mechanical, electrical SI/PI, and thermal performance for various types of chips.
• Work with IC PD team on top level floorplanning including hard macro block placement, padring, RDL and bump pattern/assignment
• Drive methodology, innovations, and efficiency improvements in package design together with vendors and developers on feature development and bug resolution.
• Explore, evaluate, and develop new CAD tools, design, and verification flow.
• Working with marketing/IC/product teams on competitive analysis and road mapping package technology for future products

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level