Finish the required safety training and adhere to safety policies and laws. Ensure proper tool documentation and update reaction mechanisms as needed. Supervise and resolve issues impacting yield, excursions, defects, or output loss. Apply SPC, FDC, and 8D methodologies to optimize processes and improve tool availability. Analyze data using engineering knowledge and visualization tools to make critical process decisions. Perform project work to optimize wafer processing and increase wafer outs. Update or create procedures to align with area and global practices. Current student in a STEM degree program with an expected graduation timeframe of May-June 2027. Ability to work ~20 hours per week on‑site in Boise, ID. Availability to commit to a minimum internship duration of 6-8 months, with a preferred timeline of September 2026 through May/June 2027.
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Job Type
Part-time
Career Level
Intern
Education Level
No Education Listed