Lead Package Assembly Integration Engineer (Laser Modules)

Lightmatter•Mountain View, CA

13d•Hybrid

About The Position

Lightmatter is leading the revolution in AI data center infrastructure, enabling the next giant leaps in human progress. The company invented the world’s first 3D-stacked photonics engine, Passage™, capable of connecting thousands to millions of processors at the speed of light in extreme-scale data centers for the most advanced AI and HPC workloads. Lightmatter raised $400 million in its Series D round, reaching a valuation of $4.4 billion. We will continue to accelerate the development of data center photonics and grow every department at Lightmatter! If you're passionate about tackling complex challenges, making an impact, and being an expert in your craft, join our team of brilliant scientists, engineers, and accomplished industry leaders. Lightmatter is (re)inventing the future of computing with light! Lightmatter is seeking a Lead Package Integration Engineer to spearhead the development of advanced semiconductor laser modules. In this high-impact role, you will be responsible for defining the packaging roadmap that enables our next-generation photonic computing platforms. You will lead a multi-disciplinary technical team to solve complex thermal, mechanical, and optical challenges, bridging the gap between chip-level design and system-level integration. If you thrive at the intersection of traditional semiconductor packaging and cutting-edge silicon photonics, we want to hear from you.

Requirements

MS or PhD in Mechanical Engineering, Materials Science, Electrical Engineering, or a related field.
8+ years of experience in semiconductor packaging or micro-electronics assembly.
Experience and deep knowledge of traditional and advanced packaging technologies, materials science, and supply chain dynamics.
Proficiency in flip chip and wirebond integration, including a strong grasp of design rules for advanced substrates (HDBU, MSAP, HDI).
Proven ability to drive thermal, mechanical, and electrical simulations and analysis.

Nice To Haves

Hands-on experience with Silicon Photonics and the integration of semiconductor lasers (III-V).
Specific experience in design and manufacturing of Transceivers, Laser Module Assembly for Datacom or precision optical alignment.
Established track record of managing high-tier OSATs and specialized material suppliers.
Ability to work independently and tackle projects with minimal supervision.
Strong creative thinking skills with the ability to solve problems quickly.
Exceptional written and verbal communication skills; ability to summarize complex technical data for executive stakeholders.

Responsibilities

Drive the end-to-end design, analysis, and execution of advanced laser module packaging, overseeing thermal, mechanical, optical, and electrical workstreams.
Lead the assembly process definition for flip chip and wirebond approaches and substrate or PCB technology selection.
Specify fiber attach methods and optical connector strategies to ensure low-loss, high-reliability coupling.
Identify key reliability risks under product use conditions.
Plan and execute Design of Experiments (DOE) and perform data analysis to improve product mechanical integrity and assembly yields.
Direct external partners and OSATs to ensure seamless technology transfer and high-volume manufacturability.
Partner with the Silicon Photonics, Systems, Test and Reliability teams to evaluate architectural trade-offs and deliver optimized hardware solutions.
Summarize and communicate to key stakeholders across Lightmatter, suppliers and customers as required.
Write reports and document methodologies.