FII USA, Inc., a Foxconn Technology Group Company, is seeking a Lead Test Engineer to provide technical leadership in developing and managing test processes and expanding test capacity for printed circuit board assemblies. Once a part of the team, you will be responsible for leading test engineering activities within the Testing Department in a production environment and have the opportunity to demonstrate technical and people leadership while expanding your career in Smart Manufacturing. The Lead Test Engineer will oversee test process strategy and capacity utilization for Surface Mount Technology (SMT) lines, support New Product Introduction (NPI), and provide mentorship and technical direction to test engineering and production teams.
Stand Out From the Crowd
Upload your resume and get instant feedback on how well it matches this job.
Job Type
Full-time
Career Level
Mid Level