Manufacturing Technician - Wire Bonding

Microchip Technology Inc.•Lawrence, MA

101d•$21 - $35

About The Position

We are seeking a detail-oriented and technically skilled Manufacturing Technician to join our Discrete Products Group (DPG) component manufacturing department in Lawrence, MA. The ideal candidate will have experience in automatic or manual aluminum wire bonding techniques and semiconductor manufacturing processes. You will play a crucial role in the production of our high-quality electronic components, ensuring that our products meet the highest standards.

Requirements

Ability to multi-task while paying careful attention to detail
Prior success working both individually and in a team environment
Good written and verbal communication skills
Ability to follow written and verbal direction
Ability to read, comprehend and follow detailed work specifications
Excellent listening skills
Adaptability to frequent change and improvements
Regular and predictable attendance is essential
Ability to wear the required Protective Equipment
Basic computer, math and reading comprehension skills
You must be 18 years old with a high school diploma or GED
High school diploma or equivalent; technical degree or certification in electronics, microelectronics, or a related field is preferred.
Minimum of 2 years of experience in a wire bonding or semiconductor manufacturing role.
Proficiency with automated wire bonding machinery and manual wire bonding techniques.
Strong understanding of microelectronics and the ability to work with delicate components.
Ability to read and interpret technical drawings and process specifications.
Excellent manual dexterity and hand-eye coordination
Excellent visual capability to work with extremely small die, without magnification devices.
Experience using tweezers, vacuum pencils, etc.
Strong problem-solving skills and attention to detail.
Ability to work in a fast-paced, team-oriented environment.
Good communication skills, both written and verbal.
This job requires access to technology, materials, software or hardware that is controlled by the export laws of the United States. Candidates are required to provide proof of either US citizenship, Permanent US residency or classification as a protected individual as defined in 8 USC 1324b (a) (3).

Responsibilities

Operate wire bonding machines and equipment with precision and according to standard operating procedures.
Perform manual wire bonding tasks as needed, utilizing microscopes and bonding tools.
Inspect and test wire bonds to ensure quality and compliance with specifications.
Perform wire bond equipment setup including tool changes, wire changes, and
Troubleshoot wire bond equipment and process issues, implementing corrective actions to minimize downtime.
Maintain accurate records of production data, process adjustments, and equipment maintenance.
Collaborate with engineering and quality assurance teams to improve wire bonding processes and product quality.
Adhere to cleanroom protocols and safety guidelines to maintain a safe and efficient work environment.
Participate in continuous improvement initiatives and training programs to enhance technical skills and knowledge.
Assist in the training of new technicians and support staff as required
Perform other tasks and assist with various projects as needed.
Good computer skills are required to support retrieval of drawings and work instructions as well as other job activities.
Good interpersonal, teaming and communication skills

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive base pay, restricted stock units, and quarterly bonus payments. In addition to these components, our package includes health benefits that begin day one, retirement savings plans, and an industry leading ESPP program with a 2 year look back feature.
Benefits of working at Microchip

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