Mechanical Engineer - Thermal Analysis (RF Systems)

LufCo•Aberdeen, MD

About The Position

We are seeking a Mechanical Engineer with a specialized focus on the thermal management of high-power RF electronics. This role is responsible for the thermal architecture of mission-critical DoD systems, ensuring hardware survivability in extreme environments. You will utilize CST Studio Suite to bridge the gap between electromagnetic performance and thermal reality, driving the design of ruggedized enclosures from concept through environmental qualification.

Requirements

BS in Mechanical Engineering with a focus on Heat Transfer or Fluid Dynamics. MS is preferred.
7+ years of relevant engineering experience.
5+ years of experience with CST Studio Suite (specifically the Thermal and Conjugate Heat Transfer solvers).
DoD Standards Expertise: Proven experience designing to and testing for: MIL-STD-810H: Environmental Engineering Considerations (Temperature, Humidity, Altitude, Vibration).
MIL-HDBK-217: Reliability Prediction for Electronic Equipment.
MIL-STD-461G: Requirements for the Control of Electromagnetic Interference (understanding the thermal impact of EMI shielding/gaskets).
Advanced Materials: Knowledge of AlSiC, graphite foam, or synthetic diamond heat spreaders for high-flux RF components.
Two-Phase Cooling: Experience with heat pipes, vapor chambers, or pumped two-phase cooling cycles for high-density electronics.
Correlation: Experience using IR thermography and fiber-optic temperature sensors to validate CST models against physical prototypes.
Ability to travel as required.
Active Secret Clearance Required; Ability to obtain TS/SCI

Responsibilities

Advanced Multiphysics Modeling: Utilize CST Studio Suite to perform coupled EM-Thermal simulations. Quantify how RF losses (insertion loss, dielectric loss) translate into thermal loads.
Electronics Packaging: Aid in the design and optimization of enclosures for SWaP-constrained environments, ensuring high-power components like GaN (Gallium Nitride) power amplifiers remain within junction temperature limits.
Environmental Compliance: Ensure all mechanical designs meet stringent DoD survivability requirements, including thermal shock, solar radiation, and extreme ambient operating temperatures.
Subsystem Integration: Direct the design of advanced cooling solutions, including micro-channel liquid cooling, phase-change materials (PCM), and high-conductivity thermal interface materials (TIMs).