Module Development Engineer

Intel • Hillsboro, OR

20h • Onsite

About The Position

Join Intel as a Module Development Engineer and become a pivotal force driving cutting-edge technology development and enablement in high-volume manufacturing and future technologies. In this role, you will play an integral part in the design and development of sophisticated manufacturing processes, enabling innovative product designs and functional requirements. Your expertise will directly contribute to Intel's leadership in advanced semiconductor technologies, empowering the company to continue its pursuit of Moore's Law and industry-leading innovation. You will collaborate with world-class teams and industry partners to shape the future of technology, delivering impactful solutions that will define the next generation of device architectures. Your contribution will have a direct impact on shaping the future of Intel's advanced packaging technologies. Apply now and explore how your skills and passion can drive innovation and success at Intel.

Requirements

• Bachelor's degree in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, Organic Chemistry, Polymer Engineering, or similar engineering disciplines with at least 1+ years of related experience in semiconductor processing, manufacturing processing, process development, or working in a cleanroom environment OR Master's degree in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, Organic Chemistry, Polymer Engineering, or similar engineering disciplines with related experience in semiconductor processing, manufacturing process, process development, or working in a cleanroom environment

Nice To Haves

• PhD degree in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, Organic Chemistry, Polymer Engineering, or similar engineering disciplines
• Technical innovation and ability to deliver results on complex, time-critical technical projects
• Experience with semiconductor packaging and assembly technologies
• Demonstrated ability to troubleshoot and resolve complex process issues using structured problem-solving methodologies
• Familiarity with semiconductor fabrication processes and corresponding analytical techniques
• Experience working with advanced process control systems, data analysis tools (e.g., JMP software), or statistical process control systems
• Initiative in driving continuous improvement projects and collaborating across multidisciplinary teams
• Proficiency in Statistical Process Control (SPC), Design of Experiments (DOE), or other statistical methods.
• Experience with direct wafer-level assembly module engineering or fab process/hardware technology development
• Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.

Responsibilities

• Drive technology development and enablement for both high-volume manufacturing and advanced future technologies, encompassing process integration and equipment solutions
• Lead the design and development of technically sophisticated manufacturing processes and/or repair reverse engineering, including material selection, parameter optimization, equipment material handling systems (MHS), and system design
• Conduct feasibility studies to meet desired device specifications using theoretical simulations and practical engineering methods
• Perform pathfinding activities in support of process and hardware development, enabling manufacturing of innovative device architectures
• Develop roadmaps for technologies, enabling future technological advancements while pushing industry boundaries
• Collaborate with key equipment and materials suppliers to develop and implement enabling elements of advanced technologies
• Recommend and implement modifications to operating equipment to improve production efficiency, manufacturing techniques, and optimize production output for existing products
• Remain updated on relevant industrial process and material manufacturing trends and identify future process technology needs

Benefits

• We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
• Find out more about the benefits of working at Intel .

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level