New College Grad - Wafer Bonding Process Development Engineer

Micron Technology • Boise, ID

3d

About The Position

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. This job requisition is for a Process Development Engineer to work within the wafer bonding process team at Micron Technology, Inc. Micron Technology Inc. is a Fortune 500 company and employs over 53,000 workers worldwide, with headquarters in Boise, ID. Micron offers the industry’s broadest portfolio of memory solutions starting with foundational DRAM, NAND, and NOR Flash memory, and extending to SSDs, MCPs, HBM and other memory-based systems. As the only memory manufacturer in the western hemisphere, Micron has been in the industry for over forty-five years and continues to be the only U.S.-based DRAM manufacturer. Micron is one of the most prolific patent applicants in the world with over 60,000 patents granted thus far. As a Wafer Bonding Process Development Engineer, you will be part of a revolutionary 3D DRAM Technology Development team. The position promises ample opportunity for innovation, collaboration and testing new dimensions in Advanced DRAM. You will work directly with Process Integration and other process areas including Dry Etch, Wet process, Metals, CVD, Diffusion, Lithography and CMP. You will work on state-of-the-art equipment and own the process roadmap to meet the program and yield goals.

Requirements

• Education: MS preferred, or BS plus relevant semiconductor experience (required).
• Majors should include Chemical Engineering, Materials Science, or Mechanical Engineering
• Ability to resolve complex issues through root-cause or model-based problem solving.
• Working knowledge in statistics, preferably in statistical process control.
• Academic or basic knowledge of one of the wafer bonding process and associated processing within the bonding module.
• Data science basics / Python coding or programming or scripting are desirable.

Nice To Haves

• Able to thrive in a research and development environment.
• Strong analytical and creative problem-solving skills.
• Strong digital literacy, including MS Office.
• Ability to work independently, with minimal direction, focus on meeting commitments, multi-task, and manage numerous projects simultaneously.

Responsibilities

• Developing wafer bonding process to meet the physical & electrical requirements of Micron’s products.
• Optimizing wafer bonding processes to reduce cost, process variability, and improve process capability.
• Collaborating with process integration and other process development teams to develop innovative new solutions.
• Conducting root cause and failure mode analysis to understand the limitations of current hardware and driving vendors for solutions.
• Performing fundamental research to drive innovative solutions for next-generation products.
• Maintaining a technology development pilot manufacturing line.
• Support process transfer to production facilities (some domestic and/or international travel may be required).

Benefits

• Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future.
• We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget.
• Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave.
• Additionally, Micron benefits include a robust paid time-off program and paid holidays.
• For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.

What This Job Offers

• Job Type: Full-time
• Career Level: Entry Level