About The Position

onsemi is currently seeking a hands-on CMOS Image Sensor Process Integration Engineer. As a CMOS Image Sensor Process Integration Engineer at onsemi, you will own and drive new product introduction (NPI) for CMOS image sensor products through manufacturing release. Responsibilities will include developing and/or optimizing robust process flows, integrating pixel process modules into manufacturable solutions, and resolving yield and performance issues prior to high‑volume manufacturing. You will act as the technical interface between onsemi and fabrication partners, coordinating development activities, managing lots, and ensuring timely execution of experiments and deliverables. A core focus of the role is yield readiness and improvement, including designing and executing DOEs, performing detailed data analysis, troubleshooting integration issues, preparing technical reports and documents, and clearly communicating results and recommendations to both technical and management stakeholders. This role requires close collaboration with pixel design, device, and manufacturing teams to support the implementation of pixel designs, ensure compliance with CMOS design rules, and address integration challenges across the product lifecycle. You will independently drive complex process integration efforts while working cross‑functionally to improve yield, performance, and manufacturability, enabling a smooth transition of new products to high‑volume manufacturing. This role may require flexibility to work outside standard business hours (e.g. early mornings or late evenings) to support time‑critical experiments, fab activities, and cross‑functional coordination. onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world. More details about our company benefits can be found here: https://www.onsemi.com/careers/career-benefits We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work. onsemi is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, ethnicity, color, religion, ancestry, national origin, age, marital status, pregnancy, sex, sexual orientation, physical or mental disability, medical condition, genetic information, military or veteran status, gender identity, gender expression, or any other protected category under applicable federal, state, or local laws. If you are an individual with a disability and require a reasonable accommodation to complete any part of the application process, or are limited in the ability or unable to access or use this online application process and need an alternative method for applying, you may contact Talent.acquisition@onsemi.com for assistance.

Responsibilities

  • Own and drive new product introduction (NPI) for CMOS image sensor products through manufacturing release.
  • Develop and/or optimizing robust process flows
  • Integrate pixel process modules into manufacturable solutions
  • Resolve yield and performance issues prior to high‑volume manufacturing.
  • Act as the technical interface between onsemi and fabrication partners, coordinating development activities, managing lots, and ensuring timely execution of experiments and deliverables.
  • Yield readiness and improvement, including designing and executing DOEs, performing detailed data analysis, troubleshooting integration issues, preparing technical reports and documents, and clearly communicating results and recommendations to both technical and management stakeholders.
  • Collaborate with pixel design, device, and manufacturing teams to support the implementation of pixel designs, ensure compliance with CMOS design rules, and address integration challenges across the product lifecycle.
  • Independently drive complex process integration efforts while working cross‑functionally to improve yield, performance, and manufacturability, enabling a smooth transition of new products to high‑volume manufacturing.
  • Flexibility to work outside standard business hours (e.g. early mornings or late evenings) to support time‑critical experiments, fab activities, and cross‑functional coordination.
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