The Integrated Optical Packaging Engineer role leads the design, simulation, material specification and assembly process development for packaging complex, novel printed optical and electrical breadboard components within the context of integrated optical systems such as, fiber interconnects, photonic integrated circuits (PICs), optical imaging and metrology systems, and radio frequency (RF) components and subsystems such as, phased-array antenna, meta surface and devices. This role is responsible for the entire packaging lifecycle, from conceptual design to high-volume manufacturing, focusing on cost-effective, reliable, thermally and environmentally stable, precisely aligned solutions developed by collaborating with internal cross-functional teams and experienced outsourced partners. The ideal candidate will be comfortable working at the intersection of optics, electronics, precision mechanics, and nanofabrication. The position is primarily on-site, with the potential for part-time remote work.
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Job Type
Full-time
Career Level
Mid Level