Photonics Packaging Engineer

IonQ•Boston, MA

1d•$110,336 - $144,459•Onsite

About The Position

IonQ is developing the world's most powerful full-stack quantum computer based on trapped-ion technology. We are pushing past the limits of classical physics and current supercomputing technology to unlock a new era of computing. Quantum computing has the potential to impact every area of human society for the better. IonQ’s computers will soon redefine industries like medicine, materials science, finance, artificial intelligence, machine learning, cryptography, and more. IonQ is at the forefront of this technological revolution. We are looking for a Photonics Packaging Engineer. As a Packaging Engineer, you’ll be part of a cross-functional team whose mission is to lead IonQ on its journey to build the world’s best quantum computers to solve the world’s most complex problems. In this role, you will support the development and implementation of fiber-packaged integrated photonic devices. You will work closely with a team of scientists and engineers to design, test, and optimize low-loss fiber-chip interfaces and optical packaging processes to facilitate the production of deployable quantum devices at scale.

Requirements

Undergraduate degree in electrical engineering, mechanical engineering, physics, optics or a related field
3+ years of industry experience working with active alignment systems, fiber optics and integrated photonic devices
Hands-on experience performing nanofabrication and optical packaging tasks

Nice To Haves

Dedicated experience with fiber packaging process development, fiber alignment, photonic design and/or optical adhesives
Experience developing a process on automated assembly systems
Experience designing, building, and using optical testing infrastructure
Experience with fabrication processes and design constraints for nanostructures
Knowledge of cryogenic testing and operation
Familiarity with nanophotonic device modeling and CAD software is a plus

Responsibilities

Perform various fiber coupling measurements to validate device performance
Develop, optimize and increase the capacity of fiber packaging process with a focus on process yield and throughput
Work with internal test and measurement teams to benchmark performance of packaged quantum devices in cryogenic environments
Establish and maintain relationships with external vendors to facilitate scaling of packaging process