The Physical AI Model Optimization Lead will drive the technical execution of advanced robotic AI model deployment on Qualcomm Dragonwing chipsets. This is a deeply technical, hands‑on role focused on quantization, compression, optimization, mixed‑precision tuning, and hardware‑aware graph transformations using Qualcomm’s internal toolchains. This role provides exposure to industry‑leading robotics‑centric AI models, including next‑generation vision‑language‑action (VLA) architectures and complex multimodal transformers, with responsibility for taking models from research grade to highly optimized real‑time deployment on heterogeneous compute. Your work will directly impact real robots—and the teams building them.
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Job Type
Full-time
Career Level
Mid Level