Principal Industrial Engineer

BAE Systems•Cedar Rapids, IA

12d•$105,254 - $178,931•Onsite

About The Position

You don’t see it, but it’s there. Our employees work on the world’s most advanced electronics – from the latest GPS guidance systems to powering the Mars Rover to protecting the F- 35 fighter jet. At BAE Electronic Systems, you’ll be among the brightest minds, working on the aerospace and defense industry’s most difficult problems. Drawing strength from our differences, we’re innovating for the future. And you can, too. Our flexible work environment provides you a chance to change the world without giving up your personal life. We put our customers first – exemplified by our mission: “We Protect Those Who Protect Us®” In this role you will be providing technical support to Manufacturing Operations microelectronics packaging team in the form of enabling and improving the flow of product through manufacturing utilizing the disciplines of industrial and mechanical engineering. This role will provide technical guidance and leadership to the micro group for processes and materials New product introduction support and Design for Manufacturing analysis. Data analysis and process improvement in areas Support of new manufacturing technologies and equipment selection Future road map creation and execution in area Capacity and capability analysis for the area Subject Matter Expert on microelectronics packaging processes and materials for the Cedar Rapids Facility. Responsible for technical problem definition and solution in manufacturing environment. Interfaces with design engineering on incorporating changes to the designs which improve manufacturability. Determines the most efficient sequence of operations and work flow, and establishes methods for maximum utilization of production facilities and personnel Conducts studies pertaining to cost control, cost reduction, inventory control through the application of Lean principles. Determines the most efficient sequence of operations and work flow, and establishes methods for maximum utilization of production facilities and personnel. Perform assignments requiring use and application of standard engineering economics and product development principles and techniques. Maintain awareness of the technological state-of-the-art and of the Company's competitive position in the micro electronics areas. Understands and considers how facility design and layout for manufacturing processes and equipment affect economic factors, process flow, operator efficiency and comfort in performance of job duties. Individual job duties may vary. Because of the need for consistent, in-person collaboration and/or the requirement to perform all work onsite due to the nature of this particular role, it will be performed full-time on site. This means work will be conducted on location at a BAE Systems facility 100% of the time.

Requirements

Bachelor's STEM Degree
10+ Years work experience
5 + Years direct micro electronics experience
Specifically related to lithography and plating
Ability to obtain Secret Level Security Clearance

Nice To Haves

Detailed knowledge and understanding of microelectronics industry standards.
Lithography, plating, flip chip, SMT, wafer level packaging
Experience with New Production Introduction (NPI) and evaluation of new designs for DFM
Knowledge and understanding of of failure analysis equipment and techniques
SIR, FTIR, SEM, X-ray, etc
Materials science background or knowledge
Programming and troubleshooting automated equipment.
Capital equipment specification, purchase, and integration
Tool and fixture design
Lean and Six Sigma
Cpk capability studies, Gage R&R, data analysis
US Citizen and Security Clearance or the ability to obtain one

Responsibilities

providing technical support to Manufacturing Operations microelectronics packaging team in the form of enabling and improving the flow of product through manufacturing utilizing the disciplines of industrial and mechanical engineering
technical guidance and leadership to the micro group for processes and materials
New product introduction support and Design for Manufacturing analysis
Data analysis and process improvement in areas
Support of new manufacturing technologies and equipment selection
Future road map creation and execution in area
Capacity and capability analysis for the area
Subject Matter Expert on microelectronics packaging processes and materials for the Cedar Rapids Facility
Responsible for technical problem definition and solution in manufacturing environment. Interfaces with design engineering on incorporating changes to the designs which improve manufacturability
Determines the most efficient sequence of operations and work flow, and establishes methods for maximum utilization of production facilities and personnel
Conducts studies pertaining to cost control, cost reduction, inventory control through the application of Lean principles
Determines the most efficient sequence of operations and work flow, and establishes methods for maximum utilization of production facilities and personnel
Perform assignments requiring use and application of standard engineering economics and product development principles and techniques
Maintain awareness of the technological state-of-the-art and of the Company's competitive position in the micro electronics areas
Understands and considers how facility design and layout for manufacturing processes and equipment affect economic factors, process flow, operator efficiency and comfort in performance of job duties

Benefits

health, dental, and vision insurance
health savings accounts
a 401(k) savings plan
disability coverage
life and accident insurance
an employee assistance program
a legal plan
discounts on things like home, auto, and pet insurance
paid time off
paid holidays
paid parental, military, bereavement, and any applicable federal and state sick leave
Employees may participate in the company recognition program to receive monetary or non-monetary recognition awards
Other incentives may be available based on position level and/or job specifics.