ON Semiconductorposted 4 days ago
San Jose, CA
Computer and Electronic Product Manufacturing
* Collaboration with cross functional teams to familiarize with different IC packaging technologies and product lines ranging from Analog/Mixed Signal devices to Image Sensor products.
* Maintain weekly log of activities and provide weekly reports of learnings/next steps.
* Understand differences in package types and advantages/disadvantages of each one.
* Grasp an understanding of the evolution of package types and designs base on manufacturability, costs, market demands, technology and application advancements.
* Work on consolidating IC packaging database for Image Sensor Group (ISG) products.
* Work with Test groups to understand test requirements of products and methodologies including required metrics.
* Work with Rel team to learn IC packaging reliability test conditions, purpose of each test and different type of Rel test requirements base on industry (Automotive, Industrial, Aerospaceâ¦etc).
* Maintain weekly log of activities and provide weekly reports of learnings/next steps.
* Understand differences in package types and advantages/disadvantages of each one.
* Grasp an understanding of the evolution of package types and designs base on manufacturability, costs, market demands, technology and application advancements.
* Work on consolidating IC packaging database for Image Sensor Group (ISG) products.
* Work with Test groups to understand test requirements of products and methodologies including required metrics.
* Work with Rel team to learn IC packaging reliability test conditions, purpose of each test and different type of Rel test requirements base on industry (Automotive, Industrial, Aerospaceâ¦etc).
