Senior Metals Deposition Engineer

Intel • Hillsboro, OR

14h • Hybrid

About The Position

Shape the Future of Semiconductor Innovation at Intel Foundry Organization Overview Manufacturing Development Customer Engineering (MDCE) is a newly established organization within Intel Foundry Technology Manufacturing and is focused on accelerating technology ramp and manufacturing excellence. Our mission is to seamlessly transition cutting-edge technologies from development to high-volume production while making technology ramp a key competitive differentiator for Intel Foundry. Position Summary MDCE is seeking a Senior Metals Deposition Engineer to drive world-class process performance and manufacturability for advanced metals deposition modules across Intel's cutting-edge technology nodes (18A, Intel 3, and 12nm). This strategic role bridges Technology Development (TD), High Volume Manufacturing (HVM), and Customer Engineering, ensuring seamless module readiness from early development through full production ramp and ongoing support.

Requirements

• Master's degree in Chemical Engineering , Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or related engineering/science field
• 7+ years of semiconductor manufacturing, process development, or technology development experience
• 4+ years of direct experience with metals deposition modules
• Hands on Experience with one or more deposition technologies: ( PVD, CVD, and/or ALD technologies for metals, conductive films, or barrier/liner stacks )
• Experience in process development, optimization, and HVM transfer
• Previous semiconductor foundry experience

Nice To Haves

• Doctoral degree in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or related engineering/science field
• Previous semiconductor foundry experience preferred
• Experience with advanced technology nodes (10nm and below), particularly Intel 18A, Intel 3, Intel 4/7, or comparable foundry nodes
• Experience with metals deposition modules including: ( Contact/MOL metals (W, Co, Ru, liners/barriers , BEOL/Cu interconnect (Cu/Co/Ru/W, caps, barriers, seed , Advanced liners/barriers/adhesion layers or conductive films )
• Technology ramp and transfer experience from TD to HVM
• Supplier collaboration experience for hardware, chamber design, or chemistry improvements
• Cross-functional leadership experience with task forces for yield improvement and technology ramp
• Experience in integration and module interactions (e.g. deposition with CMP, lithography, etch, clean)

Responsibilities

• Strategic Leadership & Execution Align organizational objectives with technical vision and formulate strategies for cutting-edge solution delivery E xecute customer-first initiatives with relentless focus on meeting deadlines and requirements Synthesize diverse inputs to develop strategic responses and drive rapid execution of challenging schedules
• Technical Problem Solving & Collaboration Own resolution of complex technical challenges, integrating solutions across multiple organizational groups (including technology development and high volume manufacturing) Collaborate effectively with Technology Development (TD), manufacturing (TFSM), and Business Groups to achieve common goals Engage internal and external stakeholders including Integration, Device, Yield, Defect Metrology, Quality, Reliability teams, and suppliers
• Team Leadership & Industry Expertise Define team goals, remove obstacles, and ensure timely delivery of process solutions Stay current with industry-leading technologies and direction-setting trends Foster in-person collaboration to accelerate decision-making and problem resolution Take ownership of outcomes and proactively surface and resolve issues
• Soft Skills Mentoring experience and ability to serve as technical focal point Strong ownership mindset with end-to-end problem-solving capabilities Ability to thrive in fast-paced, ambiguous environments while maintaining safety, quality, and compliance standards

Benefits

• Intel offers an exceptional opportunity to work with cutting-edge technology in a collaborative and innovative environment.
• This position provides a unique platform to shape the future of Intel's semiconductor solutions while directly supporting the company's efforts to meet diverse industry needs and maintain leadership in high-volume manufacturing.
• Join us in driving the next generation of semiconductor manufacturing excellence and advancing Intel's position as a global technology leader.
• We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
• Find out more about the benefits of working at Intel .

What This Job Offers

• Job Type: Full-time
• Career Level: Senior