Senior Packaging Process Development Engineer

Intel Corporation • Chandler, AZ

1d • Onsite

About The Position

The Role and Impact As a Senior Packaging Process Development Engineer, you will play a pivotal role in shaping Intel's product packaging solutions to ensure the safe and efficient transport, display, and delivery of Intel products worldwide. Your expertise will drive innovation and sustainability in packaging design, enabling Intel to meet business objectives while exceeding customer expectations. Collaborating with cross-functional teams, you will contribute directly to Intel's success, enabling seamless product launches, improving packaging supply chains, and influencing sustainability practices. This position offers the opportunity to leave a lasting impact on Intel's product distribution channels while aligning with Intel's vision of excellence in engineering and environmental responsibility.

Requirements

• Possess a Master's degree in Engineering, Physics, Chemistry, or a related STEM field with 4+ years of educational or work experience. Or a PhD degree in the same fields with 2+ years of experience.
• Product packaging assembly processes and production methodologies.
• Statistical process control (SPC) principles and design of experiments (DOE) techniques.
• Analytical skills with proficiency in data analysis and risk assessment methods.
• Design for manufacturing (DFM) practices and packaging test criteria.
• Effective communication skills to collaborate with cross-organizational teams and external vendors and customers.
• Experience leading technical teams, influencing stakeholders, and managing resources and timelines in a matrixed environment.
• A track record of delivering results in time-critical technical projects involving innovation and strategic planning.
• Apply problem-solving techniques and fundamental engineering concepts to create novel, efficient solutions.
• Strong data analysis skills

Nice To Haves

• Prior experience with Solder joint quality assessment.
• Experience with Surface Mount Technologies, solder joint formation/quality/reliability, and package certification methodologies.
• We are looking for individuals who are passionate about engineering excellence and sustainability.

Responsibilities

• Design, develop, and qualify packaging solutions and materials that meet product and regulatory requirements.
• Lead packaging development processes, including artwork creation, concepts, prototypes, qualification testing, and specification documentation.
• Collaborate with manufacturing, logistics, regulatory, and supply chain partners to ensure packaging solutions meet operational needs.
• Identify and implement cost-saving, waste-reduction, and efficiency improvement measures for packaging processes.
• Conduct risk analysis to ensure packaging solutions comply with regulations and align with Intel's quality standards.
• Consult with cross-organizational teams on branding, marketing, SKUs, labeling, and bills of material requirements for shipments into Intel's distribution channel.
• Evaluate and qualify vendors to ensure high-quality packaging manufacturing startup and scalability.
• Benchmark packaging designs and processes against industry standards to maintain a competitive edge.
• Document and maintain technical specifications for packaging solutions to ensure consistency and clarity.

Benefits

• Intel invests in our people and offers a complete and competitive package of benefits employees and their families through every stage of life.
• We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
• Find out more about the benefits of working at Intel.

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level
• Number of Employees: 5,001-10,000 employees