Senior Staff Engineer, Package Engineering

Marvell Technology•Santa Clara, CA

1d•$150,000 - $190,000

About The Position

About Marvell Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities. At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead. Your Team, Your Impact Marvell Semiconductor, a global leader in the development and production of high-performance semiconductor technology, is seeking a seasoned Principal Packaging Engineer to join our team in Santa Clara, CA. This role is pivotal for driving innovation and excellence in our packaging engineering processes and outcomes. The successful candidate will have a deep technical background in semiconductor packaging technologies, combined with proven experience in leading and managing a team of engineers. What You Can Expect Define the optimal package solution for a given semiconductor product. Understand the product and/or end client requirements. Collaborate closely with cross functional teams – BU, CE, QA, and Product engineering, define and provide package design inputs for manufacturability, supply, performance, cost, quality, and reliability. Perform package design review. Drive OSAT and substrate suppliers on risk assessment, design review and release, BOM and process, package characterization and quality. Provide inputs to design guidelines and drive to implement the guidelines. Achieve milestone dates for all NPI schedules. Work with QA, OSAT/substrate suppliers to resolve package related quality and reliability issues. Work with procurement and suppliers on package cost analysis. Provide inputs to the package technology roadmap. Support new package and technology development. Mentor junior engineers if required. Wage $150,000.00 - $190,000.00 per year. What We're Looking For Master’s or foreign equivalent degree in Mechanical Engineering, Materials Science, Computer Science/Engineering or related technical field and three (3) years of experience in the job offered or related occupation. Experience must include three (3) years with each of the following: • Flip-chip package development and substrate review. • Large scale (>60mm) FCPBGA packages. • Semiconductor technologies, 1st-level assembly processes. • Semiconductor packaging materials. • Reliability standards and failure analysis techniques. • 2D, 2.5D, 3D and wafer-level packaging. • Program management and OSAT management. • Characterization techniques (XPS, SEM, CSAM). Additional Compensation and Benefit Elements With competitive compensation and great benefits, you will enjoy our workstyle within an environment of shared collaboration, transparency, and inclusivity. We’re dedicated to giving our people the tools and resources they need to succeed in doing work that matters, and to grow and develop with us. For additional information on what it’s like to work at Marvell, visit our Careers page. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, sexual orientation, gender identity, disability or protected veteran status. Interview Integrity To support fair and authentic hiring practices, candidates are not permitted to use AI tools (such as transcription apps, real-time answer generators like ChatGPT or Copilot, or automated note-taking bots) during interviews. These tools must not be used to record, assist with, or enhance responses in any way. Our interviews are designed to evaluate your individual experience, thought process, and communication skills in real time. Use of AI tools without prior instruction from the interviewer will result in disqualification from the hiring process. This position may require access to technology and/or software subject to U.S. export control laws and regulations, including the Export Administration Regulations (EAR). As such, applicants must be eligible to access export-controlled information as defined under applicable law. Marvell may be required to obtain export licensing approval from the U.S. Department of Commerce and/or the U.S. Department of State. Except for U.S. citizens, lawful permanent residents, or protected individuals as defined by 8 U.S.C. 1324b(a)(3), all applicants may be subject to an export license review process prior to employment. #LI-TT1 Join our talent community to hear about company news, job openings and events. Join our Talent Community! Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, automotive, and carrier architectures, our innovative technology is enabling new possibilities. At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead. Recruitment fraud is a well-known way that third parties try to get personal information or to steal money from you. Please review Marvell’s guidance here to learn more on how you can protect yourself.

Requirements

Master’s or foreign equivalent degree in Mechanical Engineering, Materials Science, Computer Science/Engineering or related technical field and three (3) years of experience in the job offered or related occupation.
Experience must include three (3) years with each of the following:
Flip-chip package development and substrate review.
Large scale (>60mm) FCPBGA packages.
Semiconductor technologies, 1st-level assembly processes.
Semiconductor packaging materials.
Reliability standards and failure analysis techniques.
2D, 2.5D, 3D and wafer-level packaging.
Program management and OSAT management.
Characterization techniques (XPS, SEM, CSAM).

Responsibilities

Define the optimal package solution for a given semiconductor product.
Understand the product and/or end client requirements.
Collaborate closely with cross functional teams – BU, CE, QA, and Product engineering, define and provide package design inputs for manufacturability, supply, performance, cost, quality, and reliability.
Perform package design review.
Drive OSAT and substrate suppliers on risk assessment, design review and release, BOM and process, package characterization and quality.
Provide inputs to design guidelines and drive to implement the guidelines.
Achieve milestone dates for all NPI schedules.
Work with QA, OSAT/substrate suppliers to resolve package related quality and reliability issues.
Work with procurement and suppliers on package cost analysis.
Provide inputs to the package technology roadmap.
Support new package and technology development.
Mentor junior engineers if required.