Responsibilities: Design SOI RFICs for 4G/5G smart phone integrated RF Front-end (RFFE) Modules. Design RF blocks and matching circuits on SOI die and PCB having compact form factor layouts handling high power. Generation of innovations IPs on new RF circuits and new RF systems to improve module performances and cost factors. Development of new conceptual design to successful volume productions by improving and optimizing transistor level and PCB level circuits. Management and development of the SOI layouts and the PCB layouts. Presenting the design details and technology evaluations among various development teams.
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Job Type
Full-time
Career Level
Mid Level