Sr. Staff Thermal Engineer

Marvell TechnologySanta Clara, CA
1d

About The Position

About Marvell Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities. At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead. Your Team, Your Impact We are seeking a Sr. Staff Thermal Engineer to join our Advanced Technology Infrastructure team to drive the development of next‑generation cooling technologies across high‑power semiconductor test and validation platforms. This role spans early‑phase research, detailed thermal‑mechanical design, and full system‑level integration with automated handlers. You will work at the intersection of advanced thermal, mechanical design, packaging, control systems, and automation, delivering thermal solutions that support our next wave of high‑power XPU and Silicon Photonics programs. This position is ideal for an engineer who enjoys hands‑on development, deep modeling, and seeing concepts become validated hardware.

Requirements

  • Bachelor’s degree in Mechanical Engineering, Thermal Engineering, Chemical Engineering, or related field and 5+ years of related professional experience OR Master’s degree and/or PhD in Mechanical Engineering, Thermal Engineering, Chemical Engineering, or related field (Preferred) with 3+ years of experience.
  • 3+ years of experience in thermal design, cooling systems, or mechanical systems for semiconductors, data centers, or high‑power electronics.
  • Proficiency with thermal simulation tools (One or more of: Flotherm, Icepak, COMSOL, Ansys, FloEFD, or equivalent).
  • Strong knowledge of heat transfer, fluid dynamics, TIMs, and mechanical stress analysis.
  • Hands‑on experience validating thermal hardware in a lab environment.
  • Experience with phase‑change cooling, cold‑plate design, or evaporative cooling systems
  • Familiarity with high‑power device testing, thermal heads, or semiconductor handlers.

Responsibilities

  • Conduct feasibility modeling for next‑generation cooling technologies, including phase‑change systems, evaporative solutions, and immersion concepts.
  • Evaluate early‑stage cooling architectures in collaboration with silicon, mechanical, and test engineering teams.
  • Perform thermal interface material (TIM) scouting, comparative research, and preliminary characterization.
  • Translate future product power‑density roadmaps into cooling performance requirements for early design phases.
  • Lead end‑to-end thermal and mechanical design of cooling assemblies, including thermal heads, manifolds, sockets, and fluid delivery structures.
  • Execute full 3D thermal simulations, conjugate heat‑transfer analysis, and transient thermal modeling to predict evaporator and cold‑plate performance.
  • Develop and validate TIM analysis
  • Own material selection and fluid‑path design for high‑flow cooling systems, ensuring stability, reliability, and manufacturability.
  • Validate integrated thermal head + socket assemblies in the lab, including structural, thermal, and reliability characterization.
  • Build reliability prediction models for thermal cycling, material fatigue, creep, and long‑term system behavior.
  • Develop multi‑zone thermal control concepts, including sensor strategy, PID algorithm design, loop‑tuning, and control‑firmware interaction.
  • Own TIM qualification workflows including thermal resistance measurement, mechanical endurance, and process compliance.
  • Script automation sequences for calibration, system setup, thermal control routines, and ATE/handler interaction.
  • Work closely with handler engineering teams to ensure seamless integration of thermal heads into ATE/SLT
  • Partner with silicon architects, packaging engineers, and electrical/mechanical design teams to ensure cooling compatibility and design alignment.
  • Collaborate with reliability, manufacturing, and test engineering teams to define qualification plans and production‑readiness criteria.
  • Interface with external vendors for thermal head manufacturing, fluid system components, TIM suppliers, and advanced materials.

Benefits

  • employee stock purchase plan with a 2-year look back
  • family support programs to help balance work and home life
  • robust mental health resources to prioritize emotional well-being
  • recognition and service awards to celebrate contributions and milestones
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