Staff Process Engineer

Qorvo • Hillsboro, OR

9h

About The Position

The candidate will be a key member of the plasma etch team tasked with driving technical solutions and enabling next‑generation plasma etch platforms for RF GaAs based integrated circuits. Responsibilities include process ownership of plasma etch modules, leading technology transitions to newer etch platforms, and ensuring robust integration with upstream and downstream process modules. The role requires close collaboration with cross‑functional groups to ensure manufacturable processes that meet quality, yield, and reliability requirements.

The ideal candidate will have greater than 5 years of process ownership experience with a strong, hands‑on understanding of plasma etch fundamentals, including plasma chemistry, etch selectivity, profile and CD control, and defect mechanisms. Demonstrated strength in data analysis, statistical process control, and structured problem‑solving is required, along with the ability to drive root‑cause investigations and implement sustainable process improvements.

Requirements

• Education: PhD, Masters, or Bachelors in one of the following areas: Chemistry, Chemical Engineering, Materials Science, Physics, Optics, Electronic or Electrical Engineering.
• PhD candidates: 3+ years of plasma etch experience.
• MS candidates: 6+ years of plasma etch experience.
• BS candidates: 8+ years of plasma etch experience.
• Strong knowledge and past tool ownership experience with RIE and ICP etch platforms.
• Exceptional technical and troubleshooting skills.
• Ability to think logically, construct meaningful experiments, analyze data, and use a structured problem-solving approach, proven application of SPC and DOE.
• Experience with data analysis tools and techniques such as JMP or Spotfire or similar SW packages.
• Excellent verbal and written communication skills, with the ability to communicate effectively at all levels of the organization.
• Ability to work collaboratively with a hands-on approach and a customer-oriented mindset.
• Capable of working in a highly dynamic environment with tolerance for ambiguity. Ability to follow instructions as well as being able to work on self-directed assignments and advise senior management.
• Keen eye for detail and precision.

Responsibilities

• process ownership of plasma etch modules
• leading technology transitions to newer etch platforms
• ensuring robust integration with upstream and downstream process modules
• close collaboration with cross‑functional groups to ensure manufacturable processes that meet quality, yield, and reliability requirements
• drive root‑cause investigations
• implement sustainable process improvements

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level
• Number of Employees: 1,001-5,000 employees