Test Module Development Engineer

Intel • Chandler, AZ

3d • Onsite

About The Position

Intel's Advanced Packaging Technology Manufacturing (APTM) group is a critical division driving the next generation of semiconductor packaging solutions. The team focuses on groundbreaking technologies that extend beyond traditional methods to enable the future of high-performance computing. Primary Focus: Advanced semiconductor packaging technologies beyond conventional approaches 3D packaging innovations and chiplet integration High‑performance computing packaging for data centers and AI applications Heterogeneous integration across diverse chip technologies Scaling packaging density while enhancing thermal and electrical performance Key Objectives: Advance Moore's Law through cutting‑edge packaging technologies Reduce system‑level power consumption while improving overall performance Support Intel's IDM 2.0 strategy and Intel Foundry Services Develop packaging solutions tailored to emerging workloads such as AI and edge computing Test Module Development Engineer responsibilities include but are not limited to: Executes test technology development and enablement for high‑mix, low‑volume testing and future technologies, provides process integration and equipment solutions, and performs feasibility studies to meet desired device specifications. Implements design and development of technically sophisticated test processes and/or repair reverse engineering, including material selection, parameter optimization, equipment metrology, and system design to enable new product designs and functional requirements. Executes pathfinding and development activities in support of the Intel Foundry advanced packaging roadmap. Implements modifications for test equipment/collateral to improve efficiency, manufacturing techniques, and optimize production output for existing products. Partners with key equipment and materials suppliers to develop and implement enabling elements of the technology. Executes technology feasibility studies through theoretical simulations and/or practical engineering methods. Remains updated on relevant industrial process and materials manufacturing trends and develops a perspective on the Intel Foundry Advanced Packaging roadmap to drive industry leadership by collaborating with vendor ecosystems for cost‑effective solutions. Behavioral traits: Excellent verbal and written communication skills. Initiative, self-motivated and ability to work independently. This position requires regular onsite presence.

Requirements

• Bachelor's degree in engineering, physics, chemistry or related STEM field with 6+ years of experience. OR
• Master's degree in engineering, physics, chemistry or related STEM field with 4+ years of experience. OR
• Ph.D. degree in engineering, physics, chemistry or related field.
• The experience outlined above should reflect a combination of the following competencies:
• - Electrical test–related experience
• - Application of statistical controls
• - FMEA and/or DOE methodologies
• Excellent verbal and written communication skills.
• Initiative, self-motivated and ability to work independently.
• This position requires regular onsite presence.

Nice To Haves

• Prior related work experience with semiconductor package design, test software, and/or test equipment/collateral/fixture development.
• Product ownership, change control management and data systems
• Project management and delivering results for time-critical technical projects.
• Technical innovation and deliver results for complex, time-critical technical projects.

Responsibilities

• Executes test technology development and enablement for high‑mix, low‑volume testing and future technologies, provides process integration and equipment solutions, and performs feasibility studies to meet desired device specifications.
• Implements design and development of technically sophisticated test processes and/or repair reverse engineering, including material selection, parameter optimization, equipment metrology, and system design to enable new product designs and functional requirements.
• Executes pathfinding and development activities in support of the Intel Foundry advanced packaging roadmap.
• Implements modifications for test equipment/collateral to improve efficiency, manufacturing techniques, and optimize production output for existing products.
• Partners with key equipment and materials suppliers to develop and implement enabling elements of the technology.
• Executes technology feasibility studies through theoretical simulations and/or practical engineering methods.
• Remains updated on relevant industrial process and materials manufacturing trends and develops a perspective on the Intel Foundry Advanced Packaging roadmap to drive industry leadership by collaborating with vendor ecosystems for cost‑effective solutions.

Benefits

• We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
• Find out more about the benefits of working at Intel .

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level
• Education Level: Ph.D. or professional degree
• Number of Employees: 5,001-10,000 employees