Thermal Architect

Intel Corporation • Phoenix, AZ

1d • Hybrid

About The Position

The Thermal Engineer will drive thermal design and analysis for GPU, AI accelerators, and data center products through both simulation and hands-on experimental work. This work in this role will support the enabling high-performance computing while meeting thermal requirements. You will assist in thermal design across silicon, package, and platform levels, supporting thermal performance optimization for advanced computing products, as well as perform laboratory testing and develop innovative thermal characterization methods. Key responsibilities include but are not limited to: Thermal Design and Analysis: Support development of packaging thermal solutions for GPU/AI products Support thermal design strategies for advanced packaging technologies, including chiplets and multi-chip modules Perform thermal, electrical, and mechanical co-design optimization Laboratory and Experimental Work: Design and execute experiments to characterize thermal performance of advanced package to system-level cooling technologies. Develop innovative thermal metrology techniques for next-generation thermal management solutions (2-phase cooling systems, and microchannel heat spreaders). Correlate experimental data with simulation results to improve predictive models Cross-Functional Collaboration Partner with silicon design, packaging, and platform teams to ensure thermal compliance and performance. Engage with external customers and ecosystem partners to align thermal solutions with product requirements. Qualifications: You must possess the minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. This position is not eligible for Intel's immigration sponsorship. Minimum Qualifications PhD in Mechanical Engineering, Thermal Sciences, or related field (or MS with 3+ years working experience in mechanical engineering/thermal sciences. At least 6 months of laboratory experience with thermal testing and experimental setup Academic focus or at least 6 months of experience in the field of heat transfer fundamentals and thermal management principles Preferred Qualifications 2+ years of experience with semiconductor or high-performance computing products Practical experience with advanced cooling technologies such as immersion cooling, 2-phase cooling, or microchannel heat spreaders Exposure to GPU/AI hardware thermal challenges Experience developing innovative thermal metrology and measurement techniques Experience with data acquisition systems and thermal instrumentation (thermocouples, IR cameras, flow meters, etc.) Familiarity with statistical analysis and experimental data processing Understanding of power electronics and energy efficiency concepts Experience with prototype development and rapid testing methodologies Ability to work effectively in cross-functional teams and communicate technical concepts clearly Track record of translating experimental results into design recommendations Strong analytical and problem-solving skills Proficient in thermal simulation tools (e.g., CFD, FEA) and experimental validation Ability to design, build, and operate thermal test equipment and instrumentation

Requirements

• PhD in Mechanical Engineering, Thermal Sciences, or related field (or MS with 3+ years working experience in mechanical engineering/thermal sciences.
• At least 6 months of laboratory experience with thermal testing and experimental setup
• Academic focus or at least 6 months of experience in the field of heat transfer fundamentals and thermal management principles

Nice To Haves

• 2+ years of experience with semiconductor or high-performance computing products
• Practical experience with advanced cooling technologies such as immersion cooling, 2-phase cooling, or microchannel heat spreaders
• Exposure to GPU/AI hardware thermal challenges
• Experience developing innovative thermal metrology and measurement techniques
• Experience with data acquisition systems and thermal instrumentation (thermocouples, IR cameras, flow meters, etc.)
• Familiarity with statistical analysis and experimental data processing
• Understanding of power electronics and energy efficiency concepts
• Experience with prototype development and rapid testing methodologies
• Ability to work effectively in cross-functional teams and communicate technical concepts clearly
• Track record of translating experimental results into design recommendations
• Strong analytical and problem-solving skills
• Proficient in thermal simulation tools (e.g., CFD, FEA) and experimental validation
• Ability to design, build, and operate thermal test equipment and instrumentation

Responsibilities

• Support development of packaging thermal solutions for GPU/AI products
• Support thermal design strategies for advanced packaging technologies, including chiplets and multi-chip modules
• Perform thermal, electrical, and mechanical co-design optimization
• Design and execute experiments to characterize thermal performance of advanced package to system-level cooling technologies.
• Develop innovative thermal metrology techniques for next-generation thermal management solutions (2-phase cooling systems, and microchannel heat spreaders).
• Correlate experimental data with simulation results to improve predictive models
• Partner with silicon design, packaging, and platform teams to ensure thermal compliance and performance.
• Engage with external customers and ecosystem partners to align thermal solutions with product requirements.

Benefits

• We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
• Find out more about the benefits of working at Intel.

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level
• Education Level: Ph.D. or professional degree