Thermal Engineer

AriecaPittsburgh, PA
1d

About The Position

Arieca is leading the commercialization of easy to deploy liquid metal embedded elastomer (LMEE) technologies, which enable unprecedented performance in applications across semiconductor, electronics, automotive, and healthcare industries. Our TIMbberTM product line targets leading semiconductor thermal interface material (TIM) challenges. As a CMU spin-out, venture-backed company, we are expanding our team to bring our lab innovations to market. Arieca is looking for a Thermal Engineer who will join our Hardware R&D team to assist the successful market introduction of our thermal interface materials (TIM). Responsibilities include design and prototyping of thermal test vehicles and their data acquisition systems, in addition to designing and implementing experiments to test hypotheses on understanding the thermo-mechanical properties of semiconductor interfaces in packaged electronics (smartphones, laptops, GPUs). Strong organizational, analytical and communication skills are required, as we need to collect data efficiently and create professional documentation, while developing processes and systems that work well within the constraints of a startup. Engagement with external vendors and ecosystem partners is possible. You will be working with a team of highly motivated and ambitious individuals with a diverse background of exceptional scientific, entrepreneurial, and industrial experiences. This position offers competitive salary and benefits including healthcare, flexible PTO, stock options, and 401(k) matching.

Requirements

  • Minimum of 1-3 years of experience working in industry or an academic research laboratory.
  • Solid foundation in thermal science, including material characterization (e.g. ASTM D5470, laser flash, thermal test vehicles, FDTR)
  • Familiar with at least one thermomechanical simulation tool (Ansys, Autodesk Fusion, etc.).
  • Experience with scientific programming in Python, Matlab, or C++. On the job, we will develop GUIs for DAQ systems, so expertise here is a bonus. Significant skills designing GUIs in LabView can substitute here.
  • Bachelor of Science or higher in Mechanical Engineering, Electrical Engineering, Mechatronics, or equivalent degrees.
  • Meticulous organizational skills, attention to detail, and pride in producing high-quality work

Nice To Haves

  • Experience designing analog electrical circuits, semiconductor packages or substrates (flip-chip, BGA, LGA, etc.), or data acquisition systems
  • Rapid prototyping and machine shop experience.
  • Experience in semiconductor industry, nondestructive testing, thermal engineering, or reliability engineering.

Responsibilities

  • Design and prototyping of thermal test vehicles and their data acquisition systems
  • Designing and implementing experiments to test hypotheses on understanding the thermo-mechanical properties of semiconductor interfaces in packaged electronics (smartphones, laptops, GPUs)
  • Collect data efficiently and create professional documentation
  • Develop processes and systems that work well within the constraints of a startup
  • Engagement with external vendors and ecosystem partners is possible.

Benefits

  • healthcare
  • flexible PTO
  • stock options
  • 401(k) matching
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