Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron is looking for experienced process engineers with experience in the fields of wafer bonding, photolithography, wet process, thin films, wafer thinning (grind and CMP). As a process engineer in the Wafer Bonding team, you will be primarily responsible for developing process technology which will enable wafer bonding performance to meet the requirements for the DRAM roadmap. You will work with the process integration, process engineering, equipment, and manufacturing teams to develop and implement solutions. At Micron, we value People, Innovation, Tenacity, Collaboration and Customer Focus. Ideal Candidates will seek to use those values to guide their work. We tackle challenging tactical and technical problems to meet the demands of our fast-paced and dynamic development environment. You will be working in a highly collaborative atmosphere, interacting with various groups to ensure robust solutions that meet the detailed physical and electrical requirements for Micron products. You will grow into an expert engineer, driving roadmaps, which have a direct influence on Micron’s global leadership in semiconductor manufacturing.
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Job Type
Full-time
Career Level
Mid Level