Wafer Dicing Technician

Teledyne Technologies Incorporated•Camarillo, CA

About The Position

Teledyne Technologies Incorporated provides enabling technologies for industrial growth markets that require advanced technology and high reliability. These markets include aerospace and defense, factory automation, air and water quality environmental monitoring, electronics design and development, oceanographic research, deepwater oil and gas exploration and production, medical imaging and pharmaceutical research. We are looking for individuals who thrive on making an impact and want the excitement of being on a team that wins. Join Teledyne Imaging Sensors as a Wafer Dicing Technician! Are you ready to launch your career to the next level? Join our mission-focused team, where we value technical excellence, collaboration, and agility. We’re the world’s leading provider of infrared sensors for space, with customers like NASA, ESA, and the US Department of Defense.

Requirements

Strong understanding of mechanical drawings on dimensions and tolerances.
Ability to use digital microscope and metrology tools.
Proficiency with Microsoft Word, PowerPoint, and Excel.
Manual dexterity to handle small, precision components.
High School Diploma with 3 years of relevant experience.
U.S. citizenship due to access restrictions.

Responsibilities

Support daily wafer dicing operation that includes container labels, wafer mounting, saw dicing, demounting, cleaning, measuring and inspection duties.
Work with responsible engineers in dicing operation for quality control, process control and continuous improvements in dicing processes and procedures.
Document and report any nonconformal event and assist root cause analysis.
Work with Manufacturing Execution System (MES) for process execution, data recording and reporting.
Follow all laboratory protocols and safety procedures.