WLA Yield Analysis Systems Eng

Intel • Hillsboro, OR

2d • Hybrid

About The Position

APTM Yield seeks a yield systems engineer to adapt, develop, deploy and sustain yield analysis software solutions in support of our aggressive advanced packaging roadmap. Responsibilities include, but are not limited to: Drive aspects of Advanced Packaging's inline defect data pipeline workflows, logic, New product introduction, configuration, and analysis enabling. Work closely with partners from automation, metrology, yield/defect metrology and manufacturing on requirements, enabling, testing and debugging of integrated defect and yield analysis capabilities. Contribute to system integration projects for enhancing advanced packaging capabilities in Klarity / Exensio / custom solutions and integrating Automated Defect Classification. Be creative, customer focused and adaptable to evolving needs as we enable rapid yield learning from technology development to high volume manufacturing.

Requirements

• Possess a Bachelor's Degree with 3+ years of relevant experience – OR – Master's degree with 2+ years of relevant experience – OR – PhD degree in Materials Science and Engineering or Mechanical Engineering or Computer Science or Data Science or Information Systems or Chemical Engineering or Electrical Engineering or Chemistry or Physics or any other related discipline.
• A course or 6+ months of experience in Python or comparable programming language
• Proven data analysis capabilities

Nice To Haves

• Strong problem-solving and teamwork skills
• Experience with Python and SQL
• Experience with Intel's wafer defect metrology and analysis ecosystem
• Experience with Industry standard Defect and Yield Analysis applications like Klarity or Exensio
• Yield improvement or defect metrology / defect reduction experience
• Demonstrated ability to deal with engineering/manufacturing domains
• Experience dealing with a data pipeline
• Experience with ADC (Automated Defect Classification) and Machine Learning / AI.
• Experience with modern distributed version control systems, particularly Git, GitLab, or GitHub

Responsibilities

• Drive aspects of Advanced Packaging's inline defect data pipeline workflows, logic, New product introduction, configuration, and analysis enabling.
• Work closely with partners from automation, metrology, yield/defect metrology and manufacturing on requirements, enabling, testing and debugging of integrated defect and yield analysis capabilities.
• Contribute to system integration projects for enhancing advanced packaging capabilities in Klarity / Exensio / custom solutions and integrating Automated Defect Classification.
• Be creative, customer focused and adaptable to evolving needs as we enable rapid yield learning from technology development to high volume manufacturing.

Benefits

• We offer a total compensation package that ranks among the best in the industry.
• It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
• Find out more about the benefits of working at Intel .

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level
• Number of Employees: 5,001-10,000 employees