Advanced Packaging SI/PI Senior Engineer

Marvell Technology•Westborough, MA

13d

About The Position

About Marvell Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities. At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead. Your Team, Your Impact The Marvell Advanced Packaging team is responsible for supporting customers with package designs that meet challenging electrical requirements. High speed signaling and challenging power delivery networks require complex and custom solutions to meet constantly advancing application needs. Many of the new designs require multi-chip and multiple component configurations with high-speed IP requirements. In addition, our team is advancing Marvell's expertise in 3D packaging, Co-packaged optics and cutting-edge substrate materials. We work with the world's leading manufacturers to solve our client's most challenging designs and integrations with industry-leading packaging techniques. What You Can Expect As a Signal and Power Integrity Engineer in the Advanced Packaging design team, you will be responsible for the following: SI/PI analysis of designs and optimization of 2D/2.5D/3D packages Interfacing with product design teams for optimized floor-planning, package related design input and power delivery network design Perform wiring studies in order to determine optimal signal routing, power delivery verification and package size determination. What We're Looking For The ideal candidate will have an interest in hardware design, signal integrity, power delivery networks, and hardware verification and design optimization. A knowledge of Electrical Engineering concepts, electro-magnetics, circuit extractions and simulation, as well as design methodology and strategies is required. In addition, the candidate will possess a bachelor's degree in Electrical Engineering with coursework in signal integrity and power delivery.

Requirements

The ideal candidate will have an interest in hardware design, signal integrity, power delivery networks, and hardware verification and design optimization.
A knowledge of Electrical Engineering concepts, electro-magnetics, circuit extractions and simulation, as well as design methodology and strategies is required.
In addition, the candidate will possess a bachelor's degree in Electrical Engineering with coursework in signal integrity and power delivery.
Understanding of signal integrity and power integrity concepts and fundamentals
Experience with simulation and analysis using tools such as Ansys HFSS, HSPICE, Keysight ADS, Cadence Sigrity.
Working knowledge of circuit extractions and simulation techniques
Ability to work with engineers in multiple locations and geographies
Strong communication, presentation and documentation skills
Familiarity with packaging technologies, materials, package substrate design rules and assembly rules

Responsibilities

SI/PI analysis of designs and optimization of 2D/2.5D/3D packages
Interfacing with product design teams for optimized floor-planning, package related design input and power delivery network design
Perform wiring studies in order to determine optimal signal routing, power delivery verification and package size determination.