Senior Staff Engineer - Advanced Packaging & Microfluidic Integration

Pacific Biosciences•Menlo Park, CA

6d•Onsite

About The Position

Senior Staff Engineer - Advanced Packaging & Microfluidic Integration Job Summary We are seeking a Senior Staff Engineer to lead advanced packaging and integration efforts for next-generation PacBio products. This role requires deep technical expertise in semiconductor packaging fundamentals combined with strong domain leadership in fluidic, microfluidic, MEMS, and biochip packaging. In this role, you will play a critical part in defining architectures and packaging solutions that integrate chips with fluidics and reagent consumables. You will drive technical direction from early concept through development and manufacturing readiness, influencing future product platforms that merge semiconductor, MEMS, and life-science consumables.

Requirements

Master’s, or Ph.D. degree in Mechanical Engineering, Electrical Engineering, Materials Science, Biomedical Engineering, or a related field.
12+ years of experience in semiconductor packaging and advanced system integration.
Strong foundation in semiconductor packaging fundamentals (assembly, substrates, interconnects, reliability).
Demonstrated expertise in one or more of the following: Microfluidic and fluidic system design; MEMS packaging; Biochip or lab-on-chip packaging; Fluidic sealing, bonding, and material compatibility with reagents
Excellent communication and cross-functional collaboration skills.
Self-driven, strategic thinker comfortable operating in ambiguous, early-concept spaces.
Excellent interpersonal, written, and verbal communication skills.
Candidates must have current authorization to work in the United States without the need for present or future sponsorship.

Nice To Haves

Experience integrating chips with consumables or disposable systems is highly desirable.
Strong understanding of manufacturability, reliability, and qualification of complex assemblies.
Proven ability to lead technically across disciplines and influence product direction.

Responsibilities

Lead the definition and development of advanced packaging solutions for integrated chip-fluidic-consumable systems.
Drive packaging architectures that integrate semiconductor devices with microfluidics, MEMS, biochips, and reagent consumables.
Define tradeoffs between performance, reliability, cost, manufacturability, and scalability.
Provide technical leadership across chip packaging, fluidic sealing, bonding, materials selection, and system integration.
Collaborate closely with design, process, reliability, chemistry, and manufacturing teams to ensure robust system-level solutions.
Lead feasibility studies, risk assessments, and early prototyping for future product concepts.
Guide process development, qualification strategies, and yield improvement for complex integrated assemblies.
Interface with external vendors, OSATs, MEMS fabs, fluidic suppliers, and material vendors.
Mentor and technically guide junior and mid-level engineers.
Contribute to intellectual property through invention disclosures and patents.
Stay current with emerging trends in semiconductor packaging, microfluidics, MEMS, and bio-consumable technologies.