Associate Solutions Architect

Accelsius, LLC • Austin, TX

7h • Hybrid

About The Position

Accelsius LLC is an Austin-based leader in innovative two-phase, direct-to-chip liquid cooling solutions for the AI and high-performance computing (HPC) era. Our proprietary NeuCool™ platform delivers serviceable, scalable, and resilient cooling—from cold plates to Coolant Distribution Units (CDUs)—designed for mission-critical data centers. With the ability to cool 4500W+ per socket, rack densities up to 250kW, industry-leading thermal resistance (0.020°C/W at 700W+ TDP), and up to 50% energy savings compared to traditional air cooling, NeuCool enables higher compute density, lower operational costs, reduced CO2 emissions, and sustainable power management. Founded in 2022 and backed by strategic investors like Johnson Controls and Legrand, Accelsius combines start-up drive and rapid innovation with deep expertise in advanced thermal management for hyperscale, colocation, edge, and enterprise environments.

We are seeking a motivated Associate Solutions Architect to join our technical pre-sales and solutions team in Austin. This role is ideal for professionals with mechanical engineering backgrounds and some exposure to data center cooling systems, MEP/HVAC, or thermal management solutions.

You will be the bridge between customers, Accelsius sales, and engineering teams by designing and proposing tailored two-phase direct-to-chip liquid cooling architectures. Accelsius solutions work in tandem with traditional heat-rejection systems. You will be required to translate customer facility requirements into high-performance, efficient solutions. This position offers hands-on impact, rapid growth, and the chance to shape the future of AI/HPC cooling in a high-energy start-up environment.

Customer-facing meetings, both online and in person, will form a large part of your role. Excellent verbal communication and problem-solving skills will be required every day, along with support at key events, trade shows, and onsite customer installations. National and international travel will be required on a limited basis.

Requirements

• Bachelor’s degree in Mechanical Engineering or a closely related field (or equivalent journeyman experience in mechanical systems, HVAC, or thermal management).
• 1–4 years of relevant experience in MEP/HVAC design, thermal management, data center infrastructure, or technical support roles—ideally with exposure to liquid cooling, precision cooling, or critical facility systems (experience or projects involving data center mechanical services, direct-to-chip cooling, or providers like Vertiv, Schneider, STULZ, Airedale, or similar is highly valued).
• Strong understanding of thermal principles, heat transfer, fluid dynamics, and cooling system design for high-performance environments.
• Excellent analytical, problem-solving, and detail-oriented skills.
• Strong communication abilities—able to explain complex technical concepts to diverse audiences (technical engineers, IT teams, executives).
• Proficiency in Microsoft Office (Excel, PowerPoint, Word); familiarity with diagramming or CAD tools (e.g., Visio, AutoCAD basics) is a plus.
• Authorized to work in the United States. No sponsorship or visa support offered.

Nice To Haves

• Exposure to liquid cooling technologies, two-phase systems, direct-to-chip cooling, or data center thermal challenges (e.g., high-density GPU/CPU cooling, AI workloads).
• Basic knowledge of data center standards (e.g., ASHRAE, OCP), energy modeling, or integration with facility systems.
• Experience in customer-facing, consulting, or pre-sales technical roles.
• Enthusiasm for fast-paced start-up culture—adaptable, proactive, and excited by ambiguity and growth opportunities.

Responsibilities

• Collaborate closely with sales teams and customers to gather and analyse requirements for high-density computing environments, including heat loads, rack configurations, redundancy needs, energy efficiency targets, and integration with existing infrastructure.
• Develop and propose liquid cooling solutions based on NeuCool technology, including direct-to-chip cold plates, manifold systems, CDUs, fluid loops, and heat rejection strategies.
• Assist in creating technical architectures, conceptual designs, performance calculations (e.g., thermal resistance, capacity sizing, PUE impact), and scalability assessments for AI, HPC, and mission-critical workloads.
• Prepare accurate technical proposals, presentations, diagrams, BOMs, and pricing documentation to communicate solution value to clients and stakeholders.
• Conduct technical presentations (virtual and in-person), participate in customer workshops, and support site surveys or evaluations for pre-installation validation.
• Occasionally assist with on-site installation support alongside service teams during commissioning or deployments.
• Serve as a subject matter expert at industry events, conferences, and trade shows to represent Accelsius and NeuCool technology.
• Ensure designs align with industry standards, safety requirements (using non-conductive, dielectric refrigerants), and sustainability goals (e.g., waterless operation, energy savings).
• Contribute to internal tools, templates, and knowledge bases to streamline solution development.
• Creating, interpreting and editing mechanical drawings. CAD skills essential.

Benefits

• Competitive salary and performance-based incentives.
• Comprehensive benefits package (health, dental, vision, 401(k), etc.).
• Hybrid work model with a minimum of 3 days in our Austin office to support collaboration and hands-on innovation.
• Opportunity for rapid career advancement in a high-growth company at the forefront of AI infrastructure cooling.
• Direct exposure to cutting-edge NeuCool technology, customer engagements, and industry events.
• Mentorship from experienced engineers and architects in a collaborative, mission-driven team.

What This Job Offers

• Job Type: Full-time
• Career Level: Entry Level