IC Packaging Integration Engineer

Advanced Micro Devices, Inc•Austin, TX

12d

About The Position

We are looking for a candidate that can drive advanced 2.5D/3D IC packaging technology development with external manufacturer/material suppliers on delivering key performance indices in terms on New Product Introduction, Supplier Manufacturing readiness, Excursion free processes, Value Engineering and Enabling new capabilities. AMD's environment is fast paced, results oriented and built upon a legion of forward-thinking people with a passion for winning technology! The successful candidates must be a team player with a commitment to meeting deadlines, have a drive for solutions and an aptitude to thrive with the ability to work in a fast-paced multi-tasking environment. He or she would have excellent cross functional project management skills, conflict management skills, strong interpersonal skills with good executive presentation & communication skills. Demonstrating strong leadership to excel in his/her work with minimum supervision and strong interest to grow in people management ladder.

Requirements

Strong knowledge in Flip Chip Packaging (while operational experience in Advanced packaging areas, bumping process, substrates manufacturing, Assembly manufacturing, lid & stiffener manufacturing process is an added advantage)
Track record of development work leading to volume production in Semiconductor manufacturing
Good leadership and interpersonal skills
Familiar with tools (JMP, minitab, failure analysis knowledge, package reliability knowledge) and industry standard (ESD, Jedec, Automotive)
Bachelor's or Master’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, or a related field.

Nice To Haves

Relevant experience in package SI(Signal Integrity) and PI(Power Integrity) is preferred
Preferred: PhD in a relevant engineering discipline.

Responsibilities

Work closely with design, foundry, substrates and OSAT teams to ensure design for manufacturing (DFM) and to integrate packaging needs into product design.
Drive for supplier engagement on continuous improvement and new capabilities ahead of need
Plan and drive for New Product Introduction activities and Ramp Up readiness with external manufacturing partners and AMD internal stakeholders
Drive external manufacturer on issue resolution and issue prevention
Monitor and improve product yield and quality through collaboration with design and manufacturing teams
Plan and execute change management from internal or external parties
Involved in regional supplier management – drive to meet Key Performance Indices
Coordinates market intelligent analysis to identify value engineering initiatives and derive short- and long-term Value Engineering roadmap to support AMD product portfolio
Prepare & present Executive Summary of projects and supplier’s performance
Coordination of activities within/external team to deliver critical metrics
Overseas travel is required