Intern - Advance Packaging Technology Development (APTD)

Micron Technology • Boise, ID

2d

About The Position

Our vision is to transform how the world uses information to enrich life for all.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
We are seeking for a highly motivated and talented intern to join our Advance Packaging Technology Development (APTD) team. The project aims to enhance engineering efficiency. The intern will work closely with our team to develop innovative solutions that improve our processes and systems. In this role, you will gain hands‑on exposure to semiconductor advance package design, assembly processes, materials, and reliability testing, while working alongside experienced engineers in a fast‑paced, high-technology development environment.
This opportunity will allow the intern to: Gain hands-on experience with real-life projects and responsibilities from day one. Work in a collaborative and innovative environment.

Requirements

• Currently pursuing a Bachelor’s or Master’ Degree in Electrical Engineering, Mechanical, Engineering, Materials Science, Chemical Engineering, Physics, or related field. Cannot graduate prior to September 2026.
• Strong analytical and problem‑solving skills with a proactive attitude
• Ability to work effectively in a team‑based engineering environment
• Excellent written and verbal communication skills

Nice To Haves

• Coursework or project experience in: Semiconductor packaging, Materials characterization, Reliability engineering, and Microelectronics fabrication
• Fundamental understanding of semiconductor manufacturing or packaging concepts
• Exposure to lab or cleanroom environments
• Interest in advanced packaging technologies such as flip‑chip, fan‑out, interposers, or 3D stacking

Responsibilities

• Support package development engineers in design, characterization, and analysis of semiconductor packages
• Assist with assembly process development, including wirebond, flip‑chip, wafer‑level packaging, or advanced 2.5D/3D integration
• Document technical findings and present results to the engineering team
• Collaborate with cross‑functional teams

Benefits

• As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth.
• Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future.
• We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget.
• Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave.
• Additionally, Micron benefits include a robust paid time-off program and paid holidays.
• For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.

What This Job Offers

• Career Level: Intern