New College Grad - Advanced Packaging Technology Development Engineer - APTD
About The Position
Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are seeking a highly motivated New College Graduate (NCG) to join the Advanced Packaging Technology Development (APTD) organization as an Advanced Packaging Engineer with a Computer Science, Computer Engineering, or Data Science background. This role focuses on applying software, data analytics, modeling, and automation to enable next generation advanced packaging technologies, including 2.5D/3D integration, HBM, hybrid bonding, and heterogeneous integration. The engineer will work closely with packaging, process, equipment, and various cross functional teams to improve design efficiency, yield, quality, reliability, and time to market through data driven solutions.
Requirements
- BS or MS in Computer Science, Computer Engineering, Data Science, or a closely related field.
- Candidates must have completed a Bachelor’s or Master’s degree within the past two years.
- Strong foundation in programming and data analysis (e.g., Python, SQL, MATLAB, R, or equivalent).
- Knowledge of statistics, data mining, machine learning, or optimization techniques.
- Ability to work with complex technical problems and translate physical or process challenges into analytical models.
- Strong communication skills and ability to collaborate across multidisciplinary engineering teams.
Nice To Haves
- Exposure to semiconductor manufacturing, advanced packaging, or hardware systems, through coursework, research, or internships.
- Experience with data visualization, dashboards, or workflow automation.
- Familiarity with modeling, simulation, or AI/ML applications in engineering or manufacturing environments.
- Understanding of yield analysis, process control, or reliability data (academic or internship experience acceptable).
- Interest in HBM, 2.5D/3D packaging, hybrid bonding, or heterogeneous integration technologies.
Responsibilities
- Develop and apply data analytics, modeling, and automation solutions to support advanced packaging technology development, qualification, and ramp activities.
- Analyze large, multi‑source datasets (process, metrology, yield, reliability, FA/RMA) to identify trends, correlations, and improvement opportunities in advanced packaging flows.
- Build and maintain scripts, dashboards, models, or ML workflows to enable packaging health monitoring, yield learning, and process optimization.
- Collaborate cross‑functionally with package design, process development, equipment, materials, manufacturing, and quality teams to translate packaging problems into computational or data-driven solutions.
- Support root cause analysis (RCA) for package defects, yield excursions, and customer returns using statistical, analytical, and visualization techniques.
- Enable traceability, automation, and digital workflows across packaging development and NPI processes.
- Contribute to documentation, methodology development, and best-practice sharing within the Advanced Packaging organization.
Benefits
- Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future.
- We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget.
- Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave.
- Additionally, Micron benefits include a robust paid time-off program and paid holidays.
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What This Job Offers
Job Type
Full-time
Career Level
Entry Level
