Principal HBM Design Architect

Micron Technology • Richardson, TX

1d

About The Position

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
For more than 43 years, Micron Technology, Inc. has advanced the world’s most innovative memory and semiconductor technologies. As an HBM Memory Design Engineer within the HBM Architecture Team, you will design, simulate, and optimize digital and analog DRAM circuits for next‑generation high‑bandwidth memory products. You will evaluate block‑level and full‑chip functionality, solve complex challenges in building, and collaborate with a distributed team to deliver highly reliable, industry‑leading HBM solutions. This role provides the opportunity to contribute to groundbreaking DRAM design, TSV‑based 3D integration, and high‑speed mixed‑signal architectures supporting Machine Learning and AI applications.

Requirements

• BSEE with 7+ years of relevant engineering experience, or MSEE with 5+ years of relevant engineering experience.
• Strong knowledge of CMOS circuit design and semiconductor device physics.
• Hands‑on experience with schematic entry and simulation tools such as Finesim and HSPICE.
• Experience with power distribution and power network analysis.
• Proficiency with scripting languages such as Python, Tcl, or Perl.

Nice To Haves

• Familiarity with DRAM or memory design fundamentals.
• Excellent analytical and problem‑solving skills with the ability to address complex design challenges.
• Strong communication and collaboration skills with the ability to clearly convey technical concepts.

Responsibilities

• Design and analyze digital, analog, and mixed‑signal circuits for HBM DRAM products.
• Perform schematic entry, simulation, and optimization of DRAM blocks including data path, ECC, command control, and clocking circuits.
• Evaluate full‑chip and block‑level functionality and deliver solutions ensuring functional accuracy.
• Conduct pathfinding and feasibility studies for next‑generation HBM architectures.
• Optimize circuit timing, area, power, and complexity across high‑speed DRAM designs.
• Support design floor planning, layout reviews, and cross‑domain integration of memory, logic, and analog circuits.
• Collaborate with global engineering teams to drive innovation and support vertical integration across design, validation, and manufacturing.
• Contribute to verification and validation strategies for highly complex HBM systems.

Benefits

• Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future.
• We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget.
• Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave.
• Additionally, Micron benefits include a robust paid time-off program and paid holidays.
• For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.

What This Job Offers

• Job Type: Full-time
• Career Level: Principal