Principal Physical Design Architect, HBM

Micron Technology • Richardson, TX

1d

About The Position

Our vision is to transform how the world uses information to enrich life for all.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
As an HBM Design Architect, you will support the development of advanced analog, mixed‑signal, and digital circuits as well as full‑chip integration for next‑generation High Bandwidth Memory (HBM) products. This role focuses on physical design and layout, including creating optimized floorplans, driving circuit placement and routing strategies, and delivering high‑quality block‑level layouts using advanced process nodes. You will collaborate closely with architecture, circuit build, and layout teams to enable groundbreaking DRAM solutions that push performance, power efficiency, and density for developing HBM technologies.

Requirements

• MS degree with 5+ years of memory‑related layout or physical design experience, or BS degree with 7+ years of relevant experience.
• Expertise with Cadence VLE/VXL and Mentor Graphics Calibre DRC/LVS.
• Strong understanding of analog layout fundamentals including matching, EM, latch‑up, coupling, IR‑drop, crosstalk, and parasitic impacts.
• Hands‑on experience developing analog and mixed‑signal layouts (e.g., sense amplifiers, LDOs, PLLs).
• Strong analytical, problem‑solving, and collaboration skills.

Nice To Haves

• Experience working on DRAM, SRAM, or memory‑centric physical design.
• Ability to clearly communicate technical concepts to design, architecture, and verification teams.
• Motivated contributor who excels in team‑based, fast‑paced engineering environments.

Responsibilities

• Develop floorplans that optimize circuit placement, routing efficiency, and power delivery networks.
• Deliver block‑level analog or mixed‑signal layouts using advanced foundry process technologies.
• Collaborate with HBM architects and circuit designers on floorplanning, placement, routing, and integration strategies.
• Evaluate timing, area, power, and complexity trade-offs for high‑speed DRAM and mixed‑signal circuits.
• Support integration of Memory, Logic, and Analog circuits for new HBM product architectures.
• Ensure alignment with developed rules, manufacturability requirements, and physical verification constraints.
• Provide design-focused insights to improve circuit robustness, performance, and reliability.
• Participate in reviews and fixing issues across physical build, parasitic extraction, and full‑chip integration.

Benefits

• Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future.
• We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget.
• Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave.
• Additionally, Micron benefits include a robust paid time-off program and paid holidays.
• For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.

What This Job Offers

• Job Type: Full-time
• Career Level: Principal