Principal Package Engineer

Marvell Technology•Santa Clara, CA

About The Position

About Marvell Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities. At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead. Your Team, Your Impact The package engineering team drives semiconductor package development from concept to mass production. The focus is New Product Introduction (NPI) which is a process that takes a concept of a semiconductor package solution and refines it into a final package design that results in the delivery of engineering samples and a subsequent production ramp-up. There is the excitement of always working on new projects and cutting-edge technologies. What You Can Expect Understand the end product and/or end client requirements and define the optimal package solution for a given semiconductor product. Working closely with cross functional teams – BU, CE, QA and Product engineering, define and provide package design inputs for manufacturability, supply, performance, cost, quality and reliability. Perform package design review. Manage and drive OSAT and substrate suppliers on risk assessment, design review and release, BOM and process, package char. and qual. Provide inputs to design guidelines and drive to implement the guidelines. Achieve milestone dates for all NPI schedules. Work with QA, OSAT/substrate suppliers to resolve package related quality/reliability issues. Work with procurement and suppliers on package cost analysis. Provide inputs to the package technology roadmap. Support new package and technology development. Manage and mentor junior engineers if required

Requirements

Bachelor’s degree in ME and Material science or related fields and 10+ years of professional experience in the semiconductor packaging field OR Master’s degree and/or PhD in ME and Material science or related fields and 7+ years of professional experience in the semiconductor packaging field.
Experience in substrate, RDL and assembly.
Experienced with flip-chip package development and substrate review.
Basic Cadence APD and AutoCAD skills.
Deep understanding of semiconductor technologies, 1st-level assembly processes, semiconductor packaging materials, reliability standards and failure analysis techniques.
Good communication skills that can enable the candidate to work well with internal cross functional teams and suppliers.
Good program management skills.
Ability to work independently, provide leadership and to exercise discretion to solve complex problems.

Nice To Haves

The ideal candidate would be knowledgeable of 2D, 2.5D, 3D and wafer-level packaging.
OSAT management experience is a plus.
Manager experience is a plus

Responsibilities

Understand the end product and/or end client requirements and define the optimal package solution for a given semiconductor product.
Working closely with cross functional teams – BU, CE, QA and Product engineering, define and provide package design inputs for manufacturability, supply, performance, cost, quality and reliability.
Perform package design review.
Manage and drive OSAT and substrate suppliers on risk assessment, design review and release, BOM and process, package char. and qual.
Provide inputs to design guidelines and drive to implement the guidelines.
Achieve milestone dates for all NPI schedules.
Work with QA, OSAT/substrate suppliers to resolve package related quality/reliability issues.
Work with procurement and suppliers on package cost analysis.
Provide inputs to the package technology roadmap.
Support new package and technology development.
Manage and mentor junior engineers if required