Semiconductor Process Development Engineer – Die Fab Operation

Keysight Technologies, Inc.•Santa Rosa, CA

17h•Onsite

About The Position

Keysight is at the forefront of technology innovation, delivering breakthroughs and trusted insights in electronic design, simulation, prototyping, test, manufacturing, and optimization. Our ~15,000 employees create world-class solutions in communications, 5G, automotive, energy, quantum, aerospace, defense, and semiconductor markets for customers in over 100 countries. Learn more about what we do. Our award-winning culture embraces a bold vision of where technology can take us and a passion for tackling challenging problems with industry-first solutions. We believe that when people feel a sense of belonging, they can be more creative, innovative, and thrive at all points in their careers. Live in beautiful Sonoma County amongst vineyards, redwood forests, rivers, lakes and coastline while working on state-of-the-art ICs and devices. Our High Frequency Technology Center, (HFTC) invents and delivers world-leading compound semiconductor and integration technology in our fabrication facilities located in Santa Rosa. Our team enables Keysight product leadership through semiconductor innovation for differentiated performance.

Requirements

B.S. or M.S. in Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, Physics, or equivalent experience.
3 years of experience in advanced semiconductor processes and devices is required and specific skills in III-V semiconductor processing is highly preferred.
Experience with statistical process control and design of experiments is required.
Candidates must have strong problem-solving and analytical skills, as well as excellent interpersonal and communication skills for successful inter and intra-group interactions.
Must have strong self-initiative and proactive attitude
The role will be based at our HQ in Santa Rosa, CA. Candidates must be local or willing to relocate to Santa Rosa area.
Candidates must be a U.S. citizen or lawful permanent resident of the U.S., protected individual under 8 U.S.C. 1324b(a)(3).

Nice To Haves

Previous experience in the following areas is highly desired: Heterogeneous integration and advanced packaging & assembly techniques, MMIC wafer thinning and Die Fab operations such as wafer grinding/polishing, laser separation, saw dicing, chip sort, auto-visual, and other backend processes.

Responsibilities

Driving heterogeneous integration development projects that are critical to Keysight’s high frequency packaging roadmap
Ownership of Die Fab processes and equipment to drive production sustaining and R&D activities.
Work closely with other process, integration, product, and circuit design engineers to define process and device performance targets
Define process flows, develop new fabrication processes and drive continuous process improvement (CPI) efforts to maximize product yield
Ensure successful transfer and maintenance of new technologies in manufacturing. Project objectives will encompass performance, reliability and manufacturing goals.
Collarborate with Operations Group to implement robust process control; diagnose and resolve process problems
Lead capital equipment acquisition projects that include tool evaluation, characterization, process development, and qualification.